Rapid thermal processing apparatus and method of manufacture of semiconductor device

ABSTRACT

A rapid thermal processing apparatus comprises a processing chamber which subjects a semiconductor substrate to rapid thermal processing. A substrate support part is arranged in the processing chamber and supports the substrate. A lamp part optically irradiates the substrate supported by the substrate support part and heats the substrate. A thermo sensor is provided to measure a temperature of the substrate. A temperature computing part computes the temperature of the substrate based on an output signal of the thermo sensor. A control part controls an irradiation intensity of the lamp part according to the temperature computed by the temperature computing part. In this apparatus, the control part is provided to correct a control parameter of the irradiation intensity of the lamp part based on a measured reflectivity of a surface of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of prior application Ser. No.11/032,087 filed on Jan. 11, 2005, the contents being incorporatedherein by reference.

This application is based upon and claims the benefit of priority ofJapanese Patent Application No. 2004-244051, filed on Aug. 24, 2004,Japanese Patent Application No. 2004-275191, filed on Sep. 22, 2004, andJapanese Patent Application No. 2004-284592, filed on Sep. 29, 2004, theentire contents of which are herein incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a rapid thermal processing apparatusand method which carries out rapid thermal processing of a semiconductorsubstrate, and a method of manufacture of a semiconductor device whichcarries out rapid thermal processing of a semiconductor substrate usingthe rapid thermal processing apparatus.

2. Description of the Related Art

As one of the semiconductor manufacturing machines and equipment, therapid thermal processing apparatus which performs rapid thermalprocessing of a semiconductor substrate (wafer) is known.

For example, the rapid thermal processing apparatus comprises theprocessing chamber, the substrate support part which is arranged in theprocessing chamber and supports the substrate, the lamp part whichoptically irradiates and heats the front surface of the substratesupported by the substrate support part, the reflector plate which isarranged on the back surface side of the substrate and reflects theradiation light from the substrate, the radiation light sensor which isarranged on the back surface side of the substrate and receives theradiation light from the substrate back surface subjected to multiplereflection between the substrate back surface and the reflector plate,the emissivity sensor which receives the radiation light from thesubstrate back surface directly, and the emissivity computing part whichcomputes the emissivity (or reflectivity) of the back surface of thesubstrate based on the output of the radiation light sensor and theoutput of the emissivity sensor.

The substrate support part in this apparatus may be composed of thecylindrical member arranged above the reflector plate of the processingchamber, and the ring-like member arranged on the upper end of thecylindrical member.

In this rapid thermal processing apparatus, when the semiconductorsubstrate is supported by the ring-like member of the substrate supportpart, the optically closed space, which is surrounded by the reflectorplate, the substrate support part and the semiconductor substrate, isformed on the back surface side of the semiconductor substrate for thepurpose of temperature detection of the semiconductor substrate by theradiation light sensor.

When performing the rapid thermal processing of the semiconductorsubstrate with the above rapid thermal processing apparatus, thesemiconductor substrate is supported by the substrate support part, andthen the semiconductor substrate is heated by the heating lamps to adesired target temperature, while the temperature of the semiconductorsubstrate is monitored by the radiation light sensor.

As the conventional technique, U.S. Pat. No. 5,154,512 discloses themethod of separating the emission light from the heating lamp and theradiation light from the semiconductor substrate based on thereflectivity (or emissivity) which is determined from the ratio of thelamp intensity to the reflected light by the substrate surface(reflected light) in which the reflected light is changed according tothe intensity changes when the intensity of the heating lamps is changedperiodically.

U.S. Pat. No. 5,155,336 discloses the rapid thermal processing apparatusand method of heating the substrate according to the predeterminedheating sequence by means of a plurality of heating lamps which arearranged so that the respective irradiation regions overlap each other.

U.S. Pat. No. 5,660,472 discloses the method and apparatus of measuringsubstrate temperature in which the optically closed space, which issurrounded by the reflector plate, arranged at the uppermost part of thechamber to face the substrate back surface, the substrate support partand the substrate back surface, is formed on the back surface side ofthe substrate, in the state where the substrate is supported by thesubstrate support part. In the method and apparatus of U.S. Pat. No.5,660,472, the temperature of the substrate is measured by using theradiation light sensor which receives the radiation light from the backsurface of the substrate provided in the optically closed space, and theirradiation intensity of the heating lamps is controlled based on themeasured temperature so that the substrate is heated to the desiredtemperature.

SUMMARY OF THE INVENTION

It is a general object of the present invention to provide an improvedrapid thermal processing apparatus.

The above-mentioned object of the present invention are achieved by arapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportingthe substrate; a lamp part optically irradiating the substrate supportedby the substrate support part and heating the substrate; a thermo sensorprovided to measure a temperature of the substrate; a temperaturecomputing part computing the temperature of the substrate based on anoutput signal of the thermo sensor; and a control part controlling anirradiation intensity of the lamp part according to the temperaturecomputed by the temperature computing part, wherein the control part isprovided to correct a control parameter of the irradiation intensity ofthe lamp part based on a reflectivity of a surface of the substratewhich is measured beforehand.

The above-mentioned object of the present invention are achieved by arapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportingthe substrate; a substrate lamp part optically irradiating a frontsurface of the substrate supported by the substrate support part andheating the substrate; a support-part lamp part optically irradiatingthe substrate support part and heating the substrate support part; aradiation light sensor arranged on a back surface side of the substrateand receiving a radiation light from the substrate; a temperaturecomputing part computing a temperature of the substrate based on anoutput signal of the radiation light sensor; and a control partcontrolling an irradiation intensity of the lamp part according to thetemperature computed by the temperature computing part, wherein thecontrol part is provided to correct a control parameter of theirradiation intensity of the lamp part based on a reflectivity of thefront surface of the substrate which is measured beforehand.

The above-mentioned object of the present invention are achieved by arapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportingthe substrate; a substrate lamp part optically irradiating a frontsurface of the substrate supported by the substrate support part andheating the substrate; a support-part lamp part optically irradiatingand heating the substrate support part; a reflector plate arranged on aback surface side of the substrate and reflecting a radiation light fromthe substrate back surface; a plurality of radiation light sensorsarranged on the side of the back surface of the substrate and receivinga radiation light from the substrate back surface subjected to multiplereflection between the substrate back surface and the reflector plate;an emissivity sensor receiving directly a radiation light from thesubstrate back surface; an emissivity computing part computing anemissivity of the back surface of the substrate based on an outputsignal of one of the plurality of radiation light sensors and an outputsignal of the emissivity sensor; a temperature computing part computinga temperature of the substrate and the substrate support part based onthe output signals of the plurality of radiation light sensors and anoutput signal of the emissivity computing part; and a control partcontrolling an irradiation intensity of each of the substrate lamp partand the support-part lamp part according to the temperature computed bythe temperature computing part, wherein the control part is provided tocontrol the irradiation intensity of the substrate lamp part accordingto the temperature of the substrate computed by the temperaturecomputing part, and control the irradiation intensity of thesupport-part lamp part according to a temperature of the substratesupport part computed by the temperature computing part, and wherein thecontrol part is provided to correct both a control parameter of theirradiation intensity of the substrate lamp part and a control parameterof the irradiation intensity of the support-part lamp part,respectively, based on a reflectivity of the front surface of thesubstrate which is measured beforehand.

The above-mentioned object of the present invention are achieved by arapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportingthe substrate; a substrate lamp part optically irradiating a frontsurface of the substrate supported by the substrate support part andheating the substrate; a support-part lamp part optically irradiatingand heating the substrate support part; a reflector plate arranged on aback surface side of the substrate and reflecting a radiation light fromthe substrate back surface; a plurality of radiation light sensorsarranged on the side of the back surface of the substrate and receivinga radiation light from the substrate back surface subjected to multiplereflection between the substrate back surface and the reflector plate;an emissivity sensor receiving directly a radiation light from thesubstrate back surface; an emissivity computing part computing anemissivity of the back surface of the substrate based on output signalsof the plurality of radiation light sensors and an output signal of theemissivity sensor; a support-part radiation light sensor receivingdirectly a radiation light from the substrate support part; atemperature computing part computing a temperature of the substratebased on the output signals of the plurality of radiation light sensorsand an output signal of the emissivity computing part, and computing atemperature of the substrate support part based on an output signal ofthe support-part radiation light sensor; and a control part controllingan irradiation intensity of each of the substrate lamp part and thesupport-part lamp part according to a temperature computed by thetemperature computing part, wherein the control part is provided tocontrol the irradiation intensity of the substrate lamp part accordingto the temperature of the substrate computed by the temperaturecomputing part, and control the irradiation intensity of thesupport-part lamp part according to the temperature of the substratesupport part computed by the temperature computing part, and wherein thecontrol part is provided to correct both a control parameter of theirradiation intensity of the substrate lamp part and a control parameterof the irradiation intensity of the support-part lamp part,respectively, based on a reflectivity of the front surface of thesubstrate which is measured beforehand.

The above-mentioned object of the present invention are achieved by amethod of manufacture of a semiconductor device for performing a rapidthermal processing of a semiconductor substrate using a rapid thermalprocessing apparatus which comprises a processing chamber subjecting asemiconductor substrate to rapid thermal processing, a substrate supportpart arranged in the processing chamber and supporting the substrate, alamp part optically irradiating the substrate supported by the substratesupport part and heating the substrate, a thermo sensor provided tomeasure a temperature of the substrate, a temperature computing partcomputing the temperature of the substrate based on an output signal ofthe thermo sensor, and a control part controlling an irradiationintensity of the lamp part according to the temperature computed by thetemperature computing part, the method of manufacture of thesemiconductor device comprising the steps of: performing the rapidthermal processing of the substrate; and correcting a control parameterof the irradiation intensity of the lamp part based on a reflectivity ofa surface of the substrate which is measured beforehand.

The above-mentioned object of the present invention are achieved by amethod of manufacture of a semiconductor device for performing a rapidthermal processing of a semiconductor substrate using a rapid thermalprocessing apparatus which comprises a processing chamber subjecting asemiconductor substrate to rapid thermal processing, a substrate supportpart arranged in the processing chamber and supporting the substrate, asubstrate lamp part optically irradiating a front surface of thesubstrate supported by the substrate support part and heating thesubstrate, a support-part lamp part optically irradiating and heatingthe substrate support part, a reflector plate arranged on a back surfaceside of the substrate and reflecting a radiation light from thesubstrate back surface, a plurality of radiation light sensors arrangedon the side of the back surface of the substrate and receiving aradiation light from the substrate back surface subjected to multiplereflection between the substrate back surface and the reflector plate,an emissivity sensor receiving directly a radiation light from thesubstrate back surface, an emissivity computing part computing anemissivity of the back surface of the substrate based on output signalsof the plurality of radiation light sensors and an output signal of theemissivity sensor, a support-part radiation light sensor receivingdirectly a radiation light from the substrate support part, atemperature computing part computing a temperature of the substratebased on the output signals of the plurality of radiation light sensorsand an output signal of the emissivity computing part, and computing atemperature of the substrate support part based on an output signal ofthe support-part radiation light sensor, and a control part controllingan irradiation intensity of each of the substrate lamp part and thesupport-part lamp part according to a temperature computed by thetemperature computing part, the method of manufacture of thesemiconductor device comprising the steps of: performing the rapidthermal processing of the substrate so that the control part controlsthe irradiation intensity of the substrate lamp part according to atemperature of the substrate computed by the temperature computing partand controls the irradiation intensity of the support-part lamp partaccording to a temperature of the substrate support part computed by thetemperature computing part; and correcting both a control parameter ofthe irradiation intensity of the substrate lamp part and a controlparameter of the support-part lamp part, respectively, based on areflectivity of the front surface of the substrate which is measuredbeforehand.

According to the present invention, the reflectivity of the substratesurface is measured beforehand within or outside the processing chamber,and the control parameter of the irradiation intensity of the substratelamp part and the support-part lamp part is corrected based on themeasured reflectivity. Therefore, even when performing the spikeannealing processing of a semiconductor substrate of a differentreflectivity, it is possible for the present invention to keep themaximum temperature constant, make the substrate temperature and thesubstrate support part temperature equal, and minimize the temperaturegradient of the circumference part of the substrate in contact with thesubstrate support part and the central part of the substrate.

Moreover, the above-mentioned object of the present invention areachieved by a rapid thermal processing apparatus comprising: aprocessing chamber subjecting a semiconductor substrate to rapid thermalprocessing; a substrate support part arranged in the processing chamberand supporting the substrate; a lamp part optically irradiating a frontsurface of the substrate supported by the substrate support part andheating the substrate; a thermo sensor arranged on a back surface sideof the substrate and receiving a radiation light from the substrate; atemperature computing part computing a temperature of the substratebased on an output signal of the thermo sensor; and a control partcontrolling an irradiation intensity of the lamp part according to thetemperature of the substrate computed by the temperature computing part,wherein the control part is provided to turn on the lamp partintermittently and to control the irradiation intensity of the lamp partaccording to a temperature of the substrate computed by the temperaturecomputing part based on a radiation light which is received by thethermo sensor when the lamp part is turned off.

The above-mentioned object of the present invention are achieved by amethod of rapid thermal heating of a semiconductor chip using a rapidthermal processing apparatus which comprises a processing chambersubjecting the substrate to rapid thermal processing, a substratesupport part arranged in the processing chamber and supporting thesubstrate, a lamp part optically irradiating a front surface of thesubstrate supported by the substrate support part and heating thesubstrate, a thermo sensor arranged on a back surface side of thesubstrate and receiving a radiation light from the substrate, atemperature computing part computing a temperature of the substratebased on an output signal of the thermo sensor, and a control partcontrolling an irradiation intensity of the lamp part according to thetemperature of the substrate computed by the temperature computing part,the method comprising the steps of: performing an intermittentirradiation, of the lamp part by turning on the lamp partintermittently; acquiring a first substrate temperature computed basedon an output signal of the thermo sensor when the lamp part is turnedon; acquiring a second substrate temperature computed based on an outputsignal of the thermo sensor when the lamp part is turned off; andcontrolling the irradiation intensity of the lamp part according to thesecond substrate temperature when a difference between the firstsubstrate temperature and the second substrate temperature is largerthan a predetermined threshold.

The above-mentioned object of the present invention are achieved by arapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportsthe substrate; a lamp part optically irradiating a front surface of thesubstrate supported by the substrate support part and heating thesubstrate; a thermo sensor arranged on a back surface side of thesubstrate and receiving a radiation light from the substrate; atemperature computing part computing a temperature of the substratebased on an output result of the thermo sensor; and a control partcontrolling an irradiation intensity of the lamp part according to thetemperature of the substrate computed by the temperature computing part,wherein the control part is provided to make an output power of the lamppart decrease intermittently and to control the irradiation intensity ofthe lamp part according to a temperature of the substrate computed bythe temperature computing part based on a radiation light which isreceived by the thermo sensor when the output power of the lamp part isdecreased.

According to the present invention, the lamp part including the heatinglamps is turned on intermittently or the output power of the lamp partis decreased intermittently, and the substrate temperature is computedbased on the radiation light received by the thermo sensor when the lamppart is turned off. Therefore, even when the light shadingcharacteristic of the semiconductor substrate is inadequate, it ispossible for the present invention to eliminate the influence of theemission light from the lamp part and to measure exact temperature ofthe substrate. It is possible for the present invention to correctlycontrol the irradiation intensity of the lamp part based on the thusmeasured temperature so that the substrate temperature can be controlledcorrectly even when the temperature of the semiconductor substrate islow.

Moreover, the above-mentioned object of the present invention areachieved by a rapid thermal processing apparatus comprising: aprocessing chamber subjecting a semiconductor substrate to rapid thermalprocessing; a substrate support part arranged in the processing chamberand supporting the substrate; a first lamp part optically irradiatingand heating a front surface of the substrate supported by the substratesupport part; a first radiation light sensor arranged on a back surfaceside of the substrate and receiving a radiation light from thesubstrate; a temperature computing part computing a temperature of thesubstrate based on an output signal of the first radiation light sensor;and a control part controlling an irradiation intensity of the firstlamp part according to the temperature of the substrate computed by thetemperature computing part, wherein the rapid thermal processingapparatus further comprises a second lamp part optically irradiating andheating the substrate support part, and a second radiation light sensorarranged on a back surface side of the substrate support part andreceiving a radiation light from the substrate support part, and whereinthe temperature computing part computes a temperature of the substratesupport part based on an output signal of the second radiation lightsensor, and the control part controls the irradiation intensity of thefirst lamp part based on the calculated temperature of the substrate,and controls an irradiation intensity of the second lamp part based onthe calculated temperature of the substrate support part.

The above-mentioned object of the present invention are achieved by arapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportingthe substrate; a substrate lamp part optically irradiating a frontsurface of the substrate supported by the substrate support part andheating the substrate; a support-part lamp part optically irradiatingand heating the substrate support part; a reflector plate arranged on aback surface side of the substrate and reflecting a radiation light fromthe substrate back surface; a substrate radiation light sensor arrangedon the back surface side of the substrate and receiving a radiationlight from the substrate back surface subjected to multiple reflectionbetween the substrate back surface and the reflector plate; asupport-part radiation light sensor receiving a radiation light from thesubstrate support part directly; a temperature computing part computinga temperature of the substrate based on an output result of thesubstrate radiation light sensor, and computing a temperature of thesubstrate support part based on an output signal of the support-partradiation light sensor; a control part controlling an irradiationintensity of each of the substrate lamp part and the support-part lamppart according to a temperature computed by the temperature computingpart; and an optically closed space being formed on the back surfaceside of the substrate in a state where the substrate is supported by thesubstrate support part, wherein the control part is provided to controlthe irradiation intensity of the substrate lamp part based on atemperature of the substrate computed by the temperature computing part,and to control the irradiation intensity of the support-part lamp partbased on a temperature of the substrate support part computed by thetemperature computing part.

According to the present invention, the temperature of the semiconductorsubstrate is measured, and the irradiation intensity of the substratelamp part for heating the semiconductor substrate is controlled based onthe measured substrate temperature, while the temperature of thesubstrate support part is measured, and the irradiation intensity of thesupport-part lamp part for heating the substrate support part iscontrolled based on the measured temperature of the substrate supportpart. Therefore, when performing the spike annealing processing of thesemiconductor substrate with a different reflectivity, the substratetemperature and the substrate support part temperature can be keptequal, and the temperature gradient of the substrate circumference partin contact with the substrate support part and the substrate centralpart can be minimized. Thus, when performing the spike annealingprocessing of any kind of semiconductor substrate with an arbitraryreflectivity, it is possible to carry out the temperature control withhigh accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, features and advantages of the present invention will beapparent from the following detailed description when read inconjunction with the accompanying drawings.

FIG. 1 is a diagram showing the composition of the rapid thermalprocessing apparatus in a preferred embodiment of the invention.

FIG. 2 is a diagram for explaining the reflectivity dependency of thelamp-irradiation-side surface of the semiconductor substrate of thetemperature profile in the conventional rapid thermal processingapparatus.

FIG. 3A and FIG. 3B are diagrams for explaining the correlation of thereflectivity of the lamp-irradiation-side surface of the substrate andthe maximum temperature of the spike annealing processing in theconventional rapid thermal processing apparatus.

FIG. 4A and FIG. 4B are diagrams for explaining the measurement methodof the reflectivity of a semiconductor substrate in the conventionalthermal processing method.

FIG. 5 is a diagram for explaining the relation between the reflectivityof the lamp irradiation side surface of the substrate and the lamp powerneeded to retain the substrate temperature at 550 degrees C. in theconventional rapid thermal processing apparatus.

FIG. 6 is a diagram for explaining the correlation of the maximumtemperature of the spike annealing processing and the lamp power neededto retain the substrate temperature at 550 degrees C. in theconventional rapid thermal processing apparatus.

FIG. 7A, FIG. 7B and FIG. 7C are diagrams for explaining thereflectivity dependency of the lamp irradiation side surface of thesubstrate in the temperature distribution within the substrate surfacein the conventional rapid thermal processing apparatus.

FIG. 8 is an enlarged diagram showing the substrate circumference partin the conventional rapid thermal processing apparatus.

FIG. 9A and FIG. 9B are diagrams for explaining the improvement resultof the temperature distribution within the substrate surface by theirradiation intensity adjustment of the substrate heating lamps and thesupport-part heating lamps.

FIG. 10 is an enlarged diagram showing the substrate circumference partin the rapid thermal processing apparatus in a preferred embodiment ofthe invention.

FIG. 11A through FIG. 11J are diagrams for explaining an example of thespike annealing processing to which the rapid thermal processing methodin a preferred embodiment of the invention is applied to the manufacturemethod of the semiconductor device.

FIG. 12A and FIG. 12B are diagrams showing the radial distributions ofthe ON state current characteristics of the NMOS transistor on thedisk-shaped semiconductor substrate before and after performing thecorrection by the adjustment of the lamp irradiation intensity performedby the rapid thermal processing apparatus in the preferred embodiment ofthe invention.

FIG. 13 is a flowchart for explaining the conventional rapid thermalprocessing method.

FIG. 14 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 15 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 16 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 17 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 18 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 19 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 20 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 21 is a flowchart for explaining the rapid thermal processingmethod in a preferred embodiment of the invention.

FIG. 22 is a diagram showing the composition of the conventional rapidthermal processing apparatus.

FIG. 23A and FIG. 23B are diagrams for explaining the radiation lightwhich is received by the thermo sensor in the rapid thermal processingapparatus of the present embodiment when the lamps are turned on andoff.

FIG. 24 is a diagram for explaining the time transition of the lampintensity and the temperature detected by the thermo sensor in theconventional rapid thermal processing apparatus.

FIG. 25 is a diagram for explaining the time transition of the averageof the temperatures detected by the respective thermo sensors in therapid thermal processing apparatus of the present embodiment when thelamps are turned on and off repeatedly.

FIG. 26 is a diagram for explaining the time transition of thetemperatures detected by the respective thermo sensors in the rapidthermal processing apparatus of the present embodiment when the lampsare turned on and off repeatedly.

FIG. 27A and FIG. 27B are diagrams for explaining the time transition ofthe temperature of the semiconductor substrate during the naturalcooling in the processing chamber from the time of turning off thelamps.

FIG. 28 is a flowchart for explaining the control procedure of the rapidthermal processing method in a preferred embodiment of the invention.

FIG. 29 is a diagram for explaining the time transition of the lampintensity and the thermo-sensor output in the rapid thermal processingmethod of FIG. 28.

FIG. 30 is a flowchart for explaining the control procedure of the rapidthermal processing apparatus in a preferred embodiment of the invention.

FIG. 31 is a flowchart for explaining the control procedure of theconventional rapid thermal processing apparatus in the case of the rapidthermal processing of the silicon substrate.

FIG. 32 is a flowchart for explaining the control procedure of theconventional rapid thermal processing apparatus in the case of the rapidthermal processing of the low reflectivity substrate.

FIG. 33 is a flowchart for explaining the control procedure of the rapidthermal processing apparatus in a preferred embodiment of the inventionin the case of the rapid thermal processing of the low reflectivitysubstrate.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 13 is a flowchart for explaining the conventional rapid thermalprocessing method using the above-mentioned rapid thermal processingapparatus.

Upon starting of the rapid thermal processing method of FIG. 13, therapid thermal processing apparatus monitors the temperature (Twafer) ofthe semiconductor substrate by the radiation light sensor (S1).

Next, the rapid thermal processing apparatus computes the lamp power(irradiation intensity) of the lamp part to heat the semiconductorsubstrate based on a difference of the temperature (Twafer) of thesemiconductor substrate and the setting temperature (Tset) (S2).

Next, the rapid thermal processing apparatus controls the lamp power ofthe lamp part to heat the semiconductor substrate according to thecomputed lamp power (S3). After the step S3 is performed, the control isreturned to the step S1.

Namely, while monitoring the temperature of the semiconductor substrateby the radiation light sensor on real time, the feedback control of thelamp power is performed on real time in conformity with the known PIDcontrol, so that the semiconductor substrate is heated to the desiredtarget temperature (Tset) by means of the heating lamps.

The PID control is the known temperature control technique. In thistechnique, the difference of the target value and the measured value istransformed into the controlled variable (in the present case, theelectrical voltage applied to the lamp) using the three elementaryoperations: P (proportionality), I (integral), and D (differentiation).

In the conventional rapid thermal processing apparatus, if thereflectivity of the semiconductor substrate differs in the case of thespike annealing processing in which the temperature of the semiconductorsubstrate is raised or lowered at high speed for a short time, theresponse of the temperature of the semiconductor substrate to the lamppower (irradiation intensity) may change. For this reason, thetemperature of the semiconductor substrate will be separated from thedesired target temperature only by feeding back the temperature of thesemiconductor substrate and controlling the lamp power by the lamp powercontrol part with a certain fixed PID parameter.

Moreover, the substrate support part holding the semiconductor substrateis made of a material with a heat resistance larger than that of thematerial of the semiconductor substrate, and the substrate support parthas the reflectivity and the heat capacity (specific heat, thickness)different from those of the semiconductor substrate. Hence, even if thesemiconductor substrate and the substrate support part are opticallyirradiated by the same lamp power, they are heated to differenttemperatures.

The substrate support part generally is made of SiC or the like, and itsheat capacity is larger than that of the semiconductor substrate. If thesemiconductor substrate and this substrate support part are opticallyirradiated by the same lamp power, the resulting temperature of thesubstrate support part will become lower than that of the semiconductorsubstrate.

To bring the temperature of the substrate support part close to thetemperature of the semiconductor substrate, it is necessary to make thelamp irradiation intensity of the substrate support part larger than thelamp irradiation intensity of the semiconductor substrate.

However, since any of various kinds of films is formed on the surface ofthe substrate in the semiconductor manufacturing processes and any ofvarious kinds of patterns is also formed thereon, the reflectivity ofthe surface of the substrate varies greatly with the semiconductormanufacturing processes.

Even if the balance of the irradiation intensity of the lamp forsubstrate heating and the lamp for substrate support part heating isoptimized for a first semiconductor substrate with a certainreflectivity so that the temperature of the semiconductor substrate andthe substrate support part may become the same temperature, the responseof the temperature of the semiconductor substrate to the lamp power whenperforming the spike annealing processing of a second semiconductorsubstrate with a different reflectivity differs from the time ofoptimization. In such a case, the temperature difference between thesemiconductor substrate and the substrate support part becomes large,and consequently a significant difference in temperature between thecircumference part of the semiconductor substrate in contact with thesubstrate support part and the substrate central part will arise.

The above problem occurs especially when performing the spike annealingprocessing of the semiconductor substrate with a different reflectivityin which the substrate temperature is raised or lowered at high speedfor a short time.

In addition, the precondition for the above-mentioned conventionalthermal processing method is that the light shading characteristic ofthe semiconductor substrate is adequately high. When the semiconductorsubstrate with a low carrier concentration is heated and it is in thestate where the substrate temperature is low, the light from the heatinglamps penetrates the substrate and reaches the thermo sensor forreceiving the radiation light from the semiconductor substrate, sincethe light shading characteristic in the near-infrared light region islow. Consequently, there is the problem that the measurement of exacttemperature of the semiconductor substrate is impossible.

FIG. 24 is a diagram for explaining the time transition of the lampintensity and the temperature detected by the thermo sensor in theconventional rapid thermal processing apparatus.

The time transition shown in FIG. 24 is the changes of the temperature(apparent temperature) of the semiconductor substrate detected based onthe output result of the thermo sensor in the state where the substratetemperature is low and when the semiconductor substrate with theinadequate light shading characteristic in the near infrared region isirradiated continuously by the heating lamps in the conventional rapidthermal processing apparatus.

In the temperature transition of FIG. 24, it seems that the temperatureof the semiconductor substrate is raised rapidly at the same time whenthe lamp intensity (lamp power) is raised at 4 seconds after thesemiconductor substrate is placed in the processing chamber. This isbecause the light penetrated the semiconductor substrate reached thethermo sensor, and the temperature is seemingly high. However, the truetemperature (indicated by the dotted line in FIG. 24) of thesemiconductor substrate is not reflected in this temperature transition.

Moreover, during the period of 7 to 12 seconds, the apparent temperatureseldom rises in spite of the lamp irradiation. This is because thecomponents to raise the temperature of the semiconductor substrate bythe lamp irradiation and increase the optical intensity of the radiationlight from the semiconductor substrate, and the components by theimprovement of the light shading characteristic in the near infraredregion and the decrease of the optical intensity of the emission lightcancel each other, and consequently the changes of the optical intensityreceived by the thermo sensor have become comparatively small.

Thus, in the case where the light shading characteristic of thesemiconductor substrate is inadequate, it is difficult to measure exacttemperature of the semiconductor substrate and it is difficult tocontrol the temperature of the semiconductor substrate correctly. Thelight of the heating lamp penetrates the substrate and reaches thethermo sensor for receiving the radiation light from the substrate inthis case, and the difficulty remains if the emission light penetratingthe substrate and the radiation light from the substrate are notseparated from each other.

Moreover, in the method of U.S. Pat. No. 5,154,512, the reflectivity (oremissivity) is obtained from the ratio of the difference of the maximumand the minimum of the irradiation intensity of the heating lamp and thedifference of the maximum and the minimum of the reflected light(reflected light) intensity which is associated with the lampirradiation intensity. The relative error of the reflectivity (oremissivity) becomes twice the sum of the relative error of theirradiation intensity of the heating lamp and the relative error of thereflected light intensity sensor. Furthermore, the error of thetemperature measurement will become larger since the emission light fromthe heating lamp and the radiation light from the substrate areseparated based on the emissivity computed in this way.

A description will now be given of the preferred embodiments of thepresent invention with reference to the accompanying drawings.

FIG. 1 shows the composition of the rapid thermal processing apparatusin the preferred embodiment of the invention.

The rapid thermal processing apparatus of FIG. 1 performs the rapidthermal processing of a semiconductor substrate 1 while carrying out thetemperature control of the semiconductor substrate 1.

The rapid thermal processing apparatus comprises the processing chamber2, and the substrate support part 3 which is arranged in the processingchamber 2 and supports the semiconductor substrate 1.

The substrate support part 3 comprises the cylindrical member 31arranged in the chamber bottom 4 rotatably through the bearing part 7,and the ring plate 32 attached to the upper end of the cylindricalmember 31. In the substrate support part 3, the level difference forsupporting the peripheral edge of the semiconductor substrate 1 isformed on the inner periphery of the ring plate 32.

The optically closed space 12 is formed on the back surface side of thesemiconductor substrate 1 in the state where the semiconductor substrate1 is supported by the ring plate 32, and this optically closed space 12is surrounded by the semiconductor substrate 1, the substrate supportpart 3 and the reflector plate 8. The reflector plate 8 is arranged atthe uppermost part of the chamber bottom 4 so that the reflector plate 4counts the back surface of the semiconductor substrate 1. This opticalclosed space 12 is provided for the temperature detection of a radiationlight from the semiconductor substrate 1 by the thermo sensors.

The lamp group 51 includes the plurality of heating lamps (51 a, 51 b,51 c, 51 d, 51 e) which optically irradiate and heat the semiconductorsubstrate 1 supported by the substrate support part 3, and it isarranged above the processing chamber 2. Also, the lamp group 52 isarranged for heating the substrate support part and includes theplurality of heating lamps which optically irradiate and heat thesubstrate support part 3.

Although the heating lamp groups 51 and 52 which are configured to carryout lamp irradiation of one side (the front surface side) of thesemiconductor substrate are used in the rapid thermal processingapparatus of the present embodiment, the heating method of thesemiconductor substrate according to the present invention is notlimited to this embodiment. For example, the configuration of heatinglamps which carries out lamp irradiation of both sides (the frontsurface side and the back surface side) of the semiconductor substratemay also be used in the rapid thermal processing apparatus of theinvention.

Moreover, the radiation light sensor group 61 is arranged in the chamberbottom 4 and includes the plurality of radiation light sensors (61 a, 61b, 61 c, 61 d, 61 e) which receive the radiation light from the backsurface of the semiconductor substrate 1 subjected to multiplereflection between the substrate back surface and the reflector plate 8.Also, the emissivity sensor 61 a′ is arranged in the chamber bottom 4and receives the radiation light from the back surface of thesemiconductor substrate 1 directly. Also, the radiation light sensor 62is arranged in the chamber bottom 4 near the substrate support part 2and receives the radiation light from the substrate support part 3.

The radiation light sensor group 61 is configured in the positioncorresponding to the different radial positions of the semiconductorsubstrate 1, respectively, and each radiation light sensor outputs themeasurement result (sensor output signal) of each radial position of thesemiconductor substrate 1 to the temperature computing part 9.

The emissivity sensor 61 a′ and the radiation light sensor 61 a outputthe measurement result (sensor output signal) of each radial position ofthe semiconductor substrate 1 to the emissivity computing part 13.

Although the radiation light sensors and the emissivity sensor (forexample, pyrometers) which measure temperature based on the radiationlight from the substrate are used in the rapid thermal processingapparatus of the present embodiment, the measuring method of thesubstrate temperature by the present invention is not limited to thispreferred embodiment. For example, the substrate temperature may bemeasured using the thermo sensors (for example, thermocouple etc.).

The emissivity computing part 13 computes the emissivity of the backsurface of the semiconductor substrate 1 by the monitoring of the outputsignals from the emissivity sensor 61 a′ and the radiation light sensor61 a.

The temperature computing part 9 carries out the monitoring of theoutput signal from each radiation light sensor of the radiation lightsensor group 61, and computes the temperature of the semiconductorsubstrate 1 based on both the emissivity of the back surface of thesemiconductor substrate 1 which is computed by the emissivity computingpart 13 and the radiation light from the back surface of thesemiconductor substrate 1 which is received by each radiation lightsensor.

Moreover, the temperature computing part 9 carries out the monitoring ofthe output signal from the radiation light sensor 62 for measuring thesubstrate support part temperature, and computes the temperature of thesubstrate support part 3 based on the radiation light from the substratesupport part 3 which is received by the radiation light sensor 62.

The lamp power control part 10 controls the irradiation intensity ofeach heating lamp of the lamp group 51 configured above thesemiconductor substrate 1 based on the temperature of the semiconductorsubstrate 1 computed by the temperature computing part 9.

Moreover, the lamp power control part 10 controls the irradiationintensity of each lamp of the lamp group 52 for support part heatingbased on the temperature of the substrate support part 3 computed by thetemperature computing part 9.

In order to overcome the above-mentioned problem of the conventionalrapid thermal processing apparatus, the lamp power control part 10 inthe rapid thermal processing apparatus of the present embodiment isprovided so that the lamp power control part 10 controls the irradiationintensity of the lamp group 51 for substrate heating, according to thesubstrate temperature computed by the temperature computing part 9,controls the irradiation intensity of the lamp group 52 for support partheating, according to the temperature of the substrate support part 3computed by the temperature computing part 9, and corrects theirradiation intensity of the lamp group 51 for the substrates, and thelamp group 52 for the support part, respectively, based on thereflectivity of the front surface of the semiconductor substrate whichis measured beforehand.

A description will be given of the function and operation of the lamppower control part 10 in the rapid thermal processing apparatus of thepresent embodiment with reference to FIG. 2 through FIG. 9.

FIG. 2 is a diagram for explaining the time transition of thesemiconductor substrate temperature in the temperature profile in theconventional rapid thermal processing apparatus at the time ofperforming the spike annealing processing in which the temperature israised or lowered at high speed for a short time. There are three kindsof semiconductor substrates given in FIG. 2, and the reflectivity of thelamp irradiation side surface of each substrate is different.

With respect to each of the three kinds of semiconductor substrates (thelow reflectivity substrate, the silicon substrate, the high reflectivitysubstrate), the average reflectivity R (which has a correlation with thesheet resistance Rsh) of the whole semiconductor substrate surface withthe wavelength (0.93 micrometers) of the near infrared region ismeasured outside the processing chamber 2 before performing the spikeannealing processing.

In the example of FIG. 2, the reflectivity R=0.10 of the lowreflectivity substrate, the reflectivity R=0.30 of the siliconsubstrate, and the reflectivity R=0.49 of the high reflectivitysubstrate are obtained.

The temperature profile of FIG. 2 shows that the higher the reflectivityof the semiconductor substrate, the larger the overshoot of thetemperature profile at the time of performing the spike annealingprocessing.

FIG. 3A and FIG. 3B are diagrams for explaining the correlation of thesubstrate reflectivity and the maximum temperature of the spikeannealing processing in the conventional rapid thermal processingapparatus.

As in the example of FIG. 3A, any of different films with differentreflectivities may be formed on the lamp irradiation side surface of thesemiconductor substrate, namely the three kinds of the n-typesemiconductor substrates (the low reflectivity substrate, the siliconsubstrate, the high reflectivity substrate).

Shown in FIG. 3A is the relation of the reflectivity of the lampirradiation side surface when carrying out the spike annealingprocessing of the three kinds of the n-type semiconductor substrates(the low reflectivity substrate, the silicon substrate, the highreflectivity substrate) in which the ion implantation of the p typedopant to the surface of the substrate opposite to the lamp irradiationside surface thereof is carried out, and the average in-surface sheetresistance (Rsh) of the p type diffusion layer after the spike annealingprocessing.

By obtaining the temperature sensitivity beforehand, the sheetresistance can be converted into the maximum temperature of the spikeannealing processing, or the thermal budget of the spike annealingprocessing.

As shown in the example of FIG. 3B, the relation of the reflectivity ofthe lamp irradiation side surface of the substrate and the maximumtemperature of the spike annealing processing can be represented by thesimple function.

The constant thermal budget or the constant maximum temperature can beobtained using this function by correcting the lamp power control of theheating lamps for substrate heating and the heating lamps for substratesupport part heating according to the measurement result of thereflectivity of the lamp irradiation side surface of the semiconductorsubstrate, without depending on the reflectivity of the semiconductorsubstrate.

Specifically, it is expected that the maximum temperature of the lowreflectivity substrate with the reflectivity of 0.10 is lower than thatof the silicon substrate with the reflectivity of 0.30 by 1.5 degrees C.Hence, when performing the feedback of the measurement result ofsemiconductor substrate temperature to lamp power, the targettemperature for the low reflectivity substrate is increased by 1.5degrees C., and it is possible to bring the maximum temperature close tothat of the silicon substrate with the reflectivity of 0.30.

Moreover, it is expected that the maximum temperature of the highreflectivity substrate with the reflectivity of 0.49 is higher than thatof the silicon substrate with the reflectivity of 0.30 by 1.3 degrees C.Hence, when performing the feedback of the measurement result ofsemiconductor substrate temperature to lamp power, the targettemperature for the high reflectivity substrate is decreased by 1.3degrees C., and it is possible to bring the maximum temperature close tothat of the silicon substrate with the reflectivity of 0.30.

The lamp power control part 10 in the rapid thermal processing apparatusof the present embodiment corrects the irradiation intensity of the lampgroup 51 for the substrates and the lamp group 52 for the support part,respectively based on the reflectivity of the surface of the substratewhich is measured beforehand, and therefore it is possible to keep themaximum temperature constant even when performing the spike annealingprocessing of the semiconductor substrate of a different reflectivity.This can be readily understood from FIG. 3A and FIG. 3B.

The reflectivity of the lamp irradiation side surface of thesemiconductor substrate may be measured within the processing chamber oroutside the processing chamber. However, in the case of thesemiconductor substrate subjected to the spike annealing processing, itis necessary to measure the reflectivity of the lamp irradiation sidesurface of the semiconductor substrate before the substrate temperaturereaches the maximum temperature of the spike annealing processing.

As for the reflectivity measurement wavelength, it is desirable tochoose the wavelength that is longer than the shortest wavelength of thelamp emission light and smaller than the largest wavelength at theabsorption edge of the heated substrate.

Although the reflectivity of a single wavelength may be used, thetungsten halogen lamp which is usually used in the rapid thermalprocessing apparatus is the white light. From the minimum of theluminescence wavelength of the tungsten halogen lamp, it can set to allthe wavelength regions to the absorption edge of the heated substrate.The high correction of accuracy is attained more by using the ratio ofthe lamp luminous energy reflected on the heated substrate front surfaceto the lamp luminous energy for which the emission spectrum of lamplight and the reflection spectrum of the heated substrate were asked,and which carried out incidence to the heated substrate.

Since any of various films is formed on the surface of the semiconductorsubstrate in the semiconductor manufacturing processes and any ofvarious patterns is also formed thereon, various reflectivities withinthe surface of the semiconductor substrate exist microscopically.

It is likely to be influenced of the variation in the reflectivity inthe substrate if the measurement region of reflectivity is too small.For this reason, it is desirable to use a comparatively largemeasurement region.

For example, it is desirable to use the average reflectivity of theregion larger than the size of the semiconductor chip which is formed onthe semiconductor substrate.

As a method of measuring the reflectivity of the semiconductor substratein the processing chamber, the periodic small fluctuations may be givento the irradiation intensity of the heating lamp, and the method (referto FIG. 4A) of computing the reflectivity of the semiconductor substrateby extracting the components interlocked with the fluctuations of thelamp intensity from the mix of the reflected light and the radiationlight from the semiconductor substrate may be adopted as taught in U.S.Pat. No. 5,154,512.

FIG. 4A and FIG. 4B are diagrams for explaining the measurement methodof the reflectivity of the semiconductor substrate in the conventionalthermal processing method disclosed in U.S. Pat. No. 5,154,512. FIG. 4Ashows the composition of the measuring apparatus for measuring thereflectivity of the semiconductor substrate. FIG. 4B shows the waveformof the output signal of the radiation light sensor when fluctuating theirradiation intensity of the heating lamp periodically.

As is apparent from the measurement method of FIG. 4A and FIG. 4B, thereflectivity (or emissivity) of the semiconductor substrate can beobtained from the ratio of the difference of the maximum and the minimumof the irradiation intensity of the heating lamp and the difference ofthe maximum and the minimum of the emission light (reflected light)intensity which is associated with the lamp irradiation intensity.

Moreover, the spike annealing processing generally is performed suchthat the step of retaining the temperature of the semiconductorsubstrate at a first temperature lower than the target temperature for afixed time is initially performed to make the in-surface temperature ofthe semiconductor substrate uniform, and thereafter the substratetemperature is raised or lowered at high speed to improve thehomogeneity of the maximum in-surface temperature. The simple relationexists between the reflectivity of the substrate and the value of thelamp power needed to retain the substrate at the first temperature lowerthan the target temperature. Hence, instead of the reflectivity, it isalso possible to use the lamp power value for retaining the substrate atthe first temperature.

FIG. 5 is a diagram for explaining the relation between the reflectivityof the semiconductor substrate and the lamp power needed to retain thesemiconductor substrate temperature at 550 degrees C. in theconventional rapid thermal processing apparatus.

FIG. 6 is a diagram for explaining the correlation of the maximumtemperature of the spike annealing processing and the lamp power neededto retain the substrate temperature at 550 degrees C. in theconventional rapid thermal processing apparatus.

In the example of FIG. 5, there is shown, with respect to each of thethree kinds of semiconductor substrates with different reflectivities(the low reflectivity substrate, the silicon substrate and the highreflectivity substrate), the time transition of the substratetemperature and the lamp power required to retain at 550 degrees C. whenperforming the step of retaining it for 20 seconds at 550 degrees C.,which is lower than the maximum temperature, before heating thesemiconductor substrate to the maximum temperature of 1050 degrees C. inthe case of heating the semiconductor substrate at 1050 degrees C.

It can be readily understand from FIG. 5 that the lower the reflectivityof the semiconductor substrate, the lower the lamp power required toretain the temperature of the semiconductor substrate at 550 degrees C.

As is apparent from FIG. 6, if the same method as the above-mentionedmethod of obtaining the relation of the maximum temperature of the spikeannealing processing and the reflectivity of the lamp irradiation sidesurface of the semiconductor substrate is applied, it is possible torepresent the relation of the maximum temperature of the spike annealingprocessing and the lamp power needed to retain the temperature of thesemiconductor substrate at 550 degrees C. by the simple correlationfunction.

According to the lamp power control part 10 in the rapid thermalprocessing apparatus of the present embodiment, it is possible to obtainthe constant thermal budget or the constant maximum temperature of thespike annealing according to the lamp irradiation intensity value neededto retain the substrate at 550 degrees C., without depending on thereflectivity of the semiconductor substrate, by correcting the lamppower control of the lamp group 51 for substrate heating and the lampgroup 52 for support part heating using the above correlation function.

FIG. 7A, FIG. 7B and FIG. 7C are diagrams for explaining thereflectivity dependency of the lamp irradiation side surface of thesemiconductor substrate in the in-surface temperature distribution inthe conventional rapid thermal processing apparatus.

In the example of FIG. 7A, one of the different films with the differentreflectivities is formed on the lamp irradiation side surface of thesemiconductor substrate, namely, the two kinds of n-type semiconductorsubstrates (the low reflectivity substrate, the silicon substrate).

With respect to each of the two kinds of the n-type semiconductorsubstrates (the low reflectivity substrate, the silicon substrate), theion implantation of the p type dopant to the surface of the substrateopposite to the lamp irradiation surface is carried out.

The distribution of the radial direction of the maximum temperaturewhich converted sheet resistance of p type diffusion layer after theconventional rapid thermal processing apparatus performs spike annealingprocessing for each of the silicon substrate from the relation of thesheet resistance and the maximum temperature of the spike annealingprocessing is shown.

FIG. 7B shows the surface reflectivity of each of the two kinds ofsemiconductor substrates (the low reflectivity substrate, the siliconsubstrate), and FIG. 7C shows the maximum lamp power and the differenceof each heating lamp of the lamp group 51 for substrate heating and thelamps 52 for substrate support part heating, for each of the two kindsof semiconductor substrates (the low reflectivity substrate, the siliconsubstrate).

When the semiconductor substrate rotates the center of the substrate asa shaft during rapid thermal processing and the lamp group for heatingis arranged in the shape of concentric circles, the temperaturedistribution of the hand of cut of the semiconductor substrate iscomparatively small, and the temperature distribution appears in theradial direction.

If the reflectivity which formed the nitride film on the lampirradiation side surface carries out rapid thermal processing of the lowreflectivity substrate of 0.10 where the lamp power balance of the lampgroup 51 for substrate heating and the lamp group 52 for substratesupport part heating is optimized using the silicon substrate(reflectivity 0.30) which does not form membranes at all on the lampirradiation side surface so that the temperature of the semiconductorsubstrate circumference part will fall by 10 degrees C. or more as shownin FIG. 7A.

FIG. 8 is an enlarged diagram of the semiconductor substrate supportpart in the conventional rapid thermal processing apparatus.

In FIG. 8, reference numeral 111 denotes the radiation light from theback surface of the semiconductor substrate 1, 121 d denotes the emittedradiation light of the lamp 51 d for substrate heating, and 122 denotesthe emitted radiation light of the lamp 52 for substrate support partheating, respectively. The emitted radiation light 122 of the lamp 52for substrate support part heating serves to heat not only the substratesupport part but also the semiconductor substrate circumference part.

Since the substrate support part 3 holding the semiconductor substrate 1is made of the material with the heat-resisting property larger thanthat of the semiconductor substrate 1, the reflectivity and the heatcapacity (specific heat, thickness) of the substrate support part 3differ from those of the semiconductor substrate 1. Hence, even when theirradiation intensity of the lamp power is the same, the temperature ofthe semiconductor substrate 1 and the temperature of the substratesupport part 3 become different from each other.

The substrate support part 3 usually is formed of SiC, and the heatcapacity is larger than that of the semiconductor substrate. In thiscase, when the irradiation intensity of the lamp power to thesemiconductor substrate 1 and the substrate support part 3 is the same,the temperature of the substrate support part 3 becomes lower than thatof the semiconductor substrate 1.

To overcome the problem, the temperature of the substrate support partis brought close to the temperature of the semiconductor substrate byincreasing the irradiation intensity of the lamp 52 for substratesupport part heating from the irradiation intensity of the lamp 51 d forsubstrate heating.

Usually, the balance of the irradiation intensity of each of the lamp 52for substrate support part heating and the lamp 51 d for substrateheating is optimized using the silicon substrate (reflectivity 0.30)wherein any film is not formed on the lamp irradiation side surface ofthe substrate.

For example, suppose that the rapid thermal processing of the lowreflectivity substrate with the reflectivity of 0.10 wherein the nitridefilm is formed on the lamp irradiation side surface of the substrate, isperformed under the condition of the optimized irradiation intensitybalance.

The efficiency of the substrate to absorb the lamp light increasesbecause of the small reflectivity of the substrate. With the same lamppower, the temperature of the low reflectivity substrate is raised fromthat of the silicon substrate wherein no film is formed on the substratesurface. The output signal of the sensor which monitors the temperatureof the semiconductor substrate is fed back, the lamp power control part10 lowers the irradiation intensity of the lamp 51 d for substrateheating.

Since the balance of the irradiation intensity of the lamp 52 forsupport part heating and the lamp 51 d for substrate heating is fixed,the irradiation intensity of the lamp 52 for support part heating isalso lowered with the lamp 51 d for substrate heating. Since thereflectivity of the substrate support part is fixed, the temperature ofthe substrate support part 3 is lowered from the temperature of thesemiconductor substrate 1, and the temperature of the circumference partof the semiconductor substrate 1 in contact with the substrate supportpart 3 is also lowered.

Therefore, in order to maintain the temperature gradient of thesemiconductor substrate 1 at the minimum, it is necessary to adjust thebalance of the irradiation intensity of the lamp 51 d for substrateheating and the lamp 52 for support part heating according to thereflectivity of the semiconductor substrate.

Specifically, to improve the in-surface temperature gradient of the lowreflectivity substrate with the reflectivity of 0.10 in which thenitride film is formed, it is necessary to raise the irradiationintensity of the lamp for support part heating, which has been loweredby the lowered irradiation intensity of the lamp for substrate heating.

However, as shown in FIG. 8, when the lamp light of the lamp 52 forsupport part heating serves to heat the semiconductor substratecircumference part as well, it is also necessary to simultaneously lowerthe irradiation intensity of the lamp 51 d for substrate heating to heatthe semiconductor substrate circumference part. This is because thetemperature of the substrate circumference part of the region where thelamp light for the substrate support part reaches would rise over thedesired temperature if only the irradiation intensity of the lamp 52 forsupport part heating is raised.

FIG. 9A and FIG. 9B are diagrams for explaining the improvement resultof the in-surface temperature distribution by the irradiation intensityadjustment of the lamp for substrate heating and the lamp for supportpart heating.

FIG. 9A shows the radial-direction distribution of the maximumtemperature of the low-reflectivity substrate in performing the spikeannealing processing before and after the correction of the irradiationintensity of each of the lamp 51 d for substrate heating and the lamp 52for support part heating is made. In the low-reflectivity substrate, thenitride film is formed on the lamp irradiation side surface of thesemiconductor substrate (reflectivity is 0.10). The spike annealingprocessing is performed with the conventional rapid thermal processingapparatus for the n-type semiconductor substrate in which the ionimplantation of the p type dopant to the surface opposite to the lampirradiation side surface is performed, in order to improve thein-surface temperature gradient. The sheet resistance of the p typediffusion layer is converted to the maximum temperature of the showndistribution, based on the relation between the sheet resistance and themaximum temperature of the spike annealing processing.

FIG. 9B shows the maximum lamp power before the correction, the maximumlamp power after the correction, and the power difference with respectto each heating lamp of the lamp group 51 for substrate heating and thelamp group 52 for support part heating. The correction is made byoptimizing the irradiation intensity of lamp 51 d for substrate heatingand the irradiation intensity of the lamp 52 for support part heating toimprove the in-surface temperature gradient when performing the spikeannealing processing of the low reflective substrate with thereflectivity of 0.10.

Moreover, FIG. 9B shows the correction value of the setting temperatureof each region at the time of correcting the setting temperature of thesemiconductor substrate of the region heated by each heating lamp tooptimize the irradiation intensity of lamp 51 d for substrate heatingand the lamp 52 for support part heating.

In the example of FIG. 9A, the irradiation intensity of the lamp 52 forsupport part heating is raised 3.2%, the irradiation intensity of thelamp 51 d for substrate heating to heat the substrate circumference partis lowered 3.6%, and the in-surface temperature distribution improvessharply.

Moreover, the setting temperature of the semiconductor substratecircumference part heated by the lamp 52 for support part heating israised 3.6 degrees C., the setting temperature of the region heated bythe lamp 51 d for substrate heating is lowered 1.3 degrees C., and thein-surface temperature distribution of the semiconductor substrateimproves sharply. This can be readily understood from FIG. 9A and FIG.9B.

According to the rapid thermal processing apparatus of the presentembodiment, the optimum value of the balance of the irradiationintensity of the lamp group 51 d for substrate heating and theirradiation intensity of the lamp group 52 for support part heating iscalculated beforehand according to the reflectivity of the lampirradiation side surface of the semiconductor substrate. As thecorrection function, it is implemented in the lamp power control part10. Based on the reflectivity of the lamp irradiation side surface ofthe semiconductor substrate measured beforehand, the lamp power controlpart 10 corrects the balance of the irradiation intensity of the lampgroup 51 d for substrate heating and the irradiation intensity of thelamp group 52 for support part heating, and it is possible to keep thein-surface temperature gradient of the semiconductor substrate constantwithout depending on the reflectivity of the semiconductor substrate.

FIG. 10 is an enlarged diagram of the substrate circumference part inthe rapid thermal processing apparatus in the present embodiment.

In FIG. 10, reference numeral 111 denotes the radiation light from thesemiconductor substrate 1, 121 d denotes the emitted radiation light ofthe lamp 51 d for substrate heating, 121 e denotes the emitted radiationlight of the lamp 51 e for substrate heating, and 122 denotes theemitted radiation light of the lamp 52 for support part heating,respectively.

In addition to the function described above with FIG. 9, as shown inFIG. 10, the rapid thermal processing apparatus of the presentembodiment is provided with the lamp group 52 to heat only the substratesupport part 3, and the temperature monitor 62 which measures thetemperature of the substrate support part 3. Moreover, the lamp powercontrol part 10 in the present embodiment is provided with the functionwhich controls the lamp group 52 to heat only the substrate support partbased on the temperature of the substrate support part 3 computed by thetemperature computing part 9.

Therefore, the rapid thermal processing apparatus of the presentembodiment is able to correct the temperature gradient between thesemiconductor substrate 1 and the substrate support part 3, which cannotbe corrected by using the correction function in which the optimum valueof the balance of the irradiation intensity of each of the lamp 51 d forsubstrate heating and the lamp 51 e for support part heating is computedbeforehand according to the reflectivity of the lamp irradiation sidesurface of the substrate. Therefore, it is possible for the presentembodiment to improve the in-surface temperature uniformity of thesemiconductor substrate more effectively.

As explained above, according to the rapid thermal processing apparatusof the present embodiment, the reflectivity of the semiconductorsubstrate is measured beforehand within the processing chamber oroutside the processing chamber, and the lamp power control part 10 isprovided to correct the lamp power control (or the lamp intensitycontrol parameter) of the lamp part for substrate heating and the lamppart for support part heating based on the measurement result. Thus, itis possible to manufacture the semiconductor device of uniform qualityby applying the spike annealing processing mentioned above to themanufacture of the semiconductor device.

Next, a description will be given the control procedure in the rapidthermal processing method in the preferred embodiment of the invention,which is performed by the lamp power control part 10 of the rapidthermal processing apparatus of FIG. 1 or FIG. 10, with reference toFIG. 14 through FIG. 21.

FIG. 14 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the invention.

Upon starting of the rapid thermal processing method of FIG. 14, thereflectivity of the semiconductor substrate 1 for processing isbeforehand measured within the processing chamber 2 or outside theprocessing chamber 2, and the lamp power control part 10 retains themeasured reflectivity of the semiconductor substrate 1 (S11).

Next, the lamp power control part 10 corrects the setting temperature(Tset) which is the target temperature of the spike annealingprocessing, based on the measured reflectivity of the semiconductorsubstrate 1 (S12).

Next, the temperature computing part 9 computes the temperature (Twafer)of the semiconductor substrate 1 based on the radiation light from thesemiconductor substrate 1 detected by the radiation light sensor 61(S13).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of the lamp group 51 to heat the semiconductorsubstrate 1, according to the difference of the temperature (Twafer) ofthe semiconductor substrate and the corrected setting temperature (Tset)(S14).

Next, the lamp power control part 10 controls the lamp power of the lampgroup 51 to heat the semiconductor substrate 1 according to the computedlamp power (S15). And after the step S15 is performed, the control isreturned to the step S13.

That is, monitoring the temperature of the semiconductor substrate fromthe radiation light sensor on real time, according to the known PIDcontrol, feedback control to the lamp power for heating is performed,and the semiconductor substrate is heated to the desired targettemperature (Tset) with the heating lamps.

FIG. 15 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the present invention.

In FIG. 15, steps S21, S23, and S25 are essentially the same as stepsS11, S13, and S15 in the flowchart of FIG. 14 respectively, and adescription thereof will be omitted.

In the rapid thermal processing method of FIG. 15, the lamp powercontrol part 10 corrects the PID parameter based on the measuredreflectivity of the semiconductor substrate 1, after acquiring thereflectivity of the semiconductor substrate 1 beforehand measured atstep S21 (S22).

After the computation of the temperature (Twafer) of the semiconductorsubstrate 1 is performed at step S23, the lamp power control part 10computes the lamp power (irradiation intensity) of the lamp group 51 toheat the semiconductor substrate 1 using the corrected PID parameteraccording to the difference of the temperature (Twafer) of thesemiconductor substrate and the setting temperature (Tset) (S24).

And according to the computed lamp power, the lamp power of the lampgroup 51 to heat the semiconductor substrate 1 is controlled like therapid thermal processing method of FIG. 14.

Thus, the same effectiveness can be acquired even if it corrects the PIDparameter in the lamp power control part 10 for controlling the lamppower (irradiation intensity) of the lamp group 51, instead ofcorrecting the setting temperature Tset, based on the reflectivity ofthe semiconductor substrate 1 measured beforehand.

FIG. 16 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the present invention.

In FIG. 16, steps S33 and S36 are essentially the same as steps S12 andS15 in the flowchart of FIG. 14, respectively, and a description thereofwill be omitted.

Upon starting of the rapid thermal processing method of FIG. 16, thelamp power control part 10 heats the semiconductor substrate 1 forprocessing within the processing chamber 2, and controls the lamp power(irradiation intensity) of the lamp group 51 to retain the substratetemperature for a fixed time at the first temperature sufficiently lowerthan the maximum temperature (S31).

For example, when the maximum temperature of annealing processing is1050 degrees C., the first temperature is set to 550 degrees C. which islower than the maximum temperature, and retains the semiconductorsubstrate 1 for 20 seconds at 550 degrees C. in the step S31.

Next, the lamp power control part 10 computes the reflectivity of thesubstrate 1 (which is equivalent to the temperature measured beforehandat step S11) according to the lamp power (irradiation intensity)required to retain the substrate 1 at 550 degrees C. (S32).

After the reflectivity of the substrate is computed at step S32, thelamp power control part 10 corrects the setting temperature (Tset) whichis the target temperature of the spike annealing processing based on thecomputed reflectivity (S33).

In this embodiment, the correction of the step S33 mentioned above isthe same as the correction method described above with FIG. 5 and FIG.6.

Steps S34 to S36 in the flowchart of FIG. 16 which are performed by thelamp power control part 10 are essentially the same as the steps S13 toS15 described above with FIG. 14, respectively, and a descriptionthereof will be omitted.

As previously described above with FIG. 5 and FIG. 6, the lamp powercontrol part 10 in the rapid thermal processing apparatus of the presentembodiment is provided to use the correlation function showing therelation between the maximum temperature of the spike annealingprocessing and the lamp power required to retain the substrate at thefirst temperature (550 degrees C.).

By correcting the lamp power control of the lamp group 51 for substrateheating according to the lamp irradiation intensity value required toretain the substrate at 550 degrees C., it is possible for the presentembodiment to obtain the thermal budget of fixed spike annealing or thefixed maximum temperature without depending on the reflectivity of thesemiconductor substrate.

FIG. 17 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the present invention.

In FIG. 17, steps S43 to S46 are essentially the same as the steps S22to S25 in the flowchart of FIG. 15, respectively, and a descriptionthereof will be omitted.

Upon starting of the rapid thermal processing method of FIG. 17, thelamp power control part 10 heats the semiconductor substrate 1 forprocessing within the processing chamber 2, and controls the lamp power(irradiation intensity) of the lamp group 51 to carry out fixed timeretention at the first temperature sufficiently lower than the maximumtemperature (S41).

For example, when the maximum temperature of annealing processing is1050 degrees C., the first temperature is set to 550 degrees C. lowerthan the maximum temperature, and retains the semiconductor substrate 1for the 20 seconds at 550 degrees C. in this step S31.

Next, the lamp power control part 10 computes the reflectivity of thesubstrate measured beforehand according to lamp power (irradiationintensity) required to retain the semiconductor substrate 1 at 550degrees C. (S42).

If the reflectivity of the substrate is computed at step S42, the lamppower control part 10 will correct the PID parameter based on themeasured reflectivity of the semiconductor substrate 1 (S43).

Step S44 which the lamp power control part 10 performs hereafter, or S46is the same as that of step S23 explained in FIG. 15, or S25respectively.

FIG. 18 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the present invention.

In the rapid thermal processing method of FIG. 18, first, thereflectivity of the semiconductor substrate 1 for processing isbeforehand measured within the processing chamber 2 or outside theprocessing chamber 2, and the lamp power control part 10 retains themeasured reflectivity of the semiconductor substrate 1 (S51).

Next, the lamp power control part 10 corrects the setting temperature(Tset) which is the target temperature of the spike annealingprocessing, based on the measured reflectivity of the semiconductorsubstrate 1, and computes the setting temperature (Tset_c) of thesubstrate central part, the setting temperature (Tset_m) of thesubstrate inner circumference part, and the setting temperature (Tset_e)of the substrate circumference part, based on the corrected settingtemperature (Tset′), respectively (S52).

By the following control procedures, the plurality of heating lamps ofthe lamp group 51 for substrate heating are divided into three groups ofthe heating lamps for the substrate central part, the substrate innercircumference part, and the substrate circumference part of thesemiconductor substrate 1, and the lamp power control part 10 performsthe lamp power control in parallel for every group.

That is, the lamp power control part 10 monitors temperature (Tc) of thesubstrate central part by radiation light sensor 61 a-61 c of thesubstrate central part of the semiconductor substrate 1 (S53 a).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of lamp group 51 a-51 c to heat the central partof the semiconductor substrate 1 according to the difference of thetemperature (Tc) of the substrate central part, and the correctedsetting temperature (Tset_c) (S54 a).

Next, the lamp power control part 10 controls the lamp power of lampgroup 51 a-51 c to heat the central part of the semiconductor substrate1 according to the computed lamp power (S55 a).

And the step S55 a is performed, the control is returned to the step S53a. Namely, the feedback control to the lamp group 51 a-51 c power isperformed according to the PID control while the temperature of thesemiconductor substrate 1 is monitored by the radiation light sensorgroup 61 a-61 c, and the central part of the semiconductor substrate 1is heated to the corrected target temperature (Tset_c).

In parallel to the control of the substrate central part, the lamp powercontrol part 10 monitors temperature (Tm) of the substrate innercircumference part of the semiconductor substrate 1 by the radiationlight sensor 61 d (S53 b).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of 51 d of lamp groups which heat the substrateinner circumference part of the semiconductor substrate 1 according tothe difference of the temperature (Tm) of the substrate innercircumference part, and the corrected setting temperature (Tset_m) (S54b).

Next, the lamp power control part 10 controls the lamp power of 51 d oflamp groups which heat the substrate inner circumference part of thesemiconductor substrate 1 according to the computed lamp power (S55 b).

After the step S55 b is performed, the control is returned to step S53b. That is, the feedback control to the lamp power of the lamp group forsubstrate heating, is performed according to the PID control while thetemperature of the semiconductor substrate 1 is monitored by theradiation light sensor 61 d, and the substrate inner circumference partof the semiconductor substrate 1 is heated to the correct targettemperature (Tset_m).

Moreover, in parallel to the control of the substrate central part andthe substrate inner circumference part, the lamp power control part 10monitors temperature (Te) of the substrate circumference part byradiation light sensor 61 e of the substrate circumference part of thesemiconductor substrate 1 (S53 c).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of lamp group 51 e to heat the substratecircumference part of the semiconductor substrate 1 according to thedifference of the temperature (Te) of the substrate circumference part,and the corrected setting temperature (Tset_e) (S54 c).

Next, the lamp power control part 10 controls the lamp power of lampgroup 51 e to heat the substrate circumference part of the semiconductorsubstrate 1, according to the computed lamp power (S55 c).

After the step S55 c is performed, the control is returned to the stepS53 c. That is, the feedback control to the lamp power of the lamp group51 e for substrate heating is performed according to the PID controlwhile the temperature of the semiconductor substrate 1 is monitored bythe radiation light sensor 61 e, and the substrate inner circumferencepart of the semiconductor substrate 1 is heated to the corrected targettemperature (Tset_e).

As previously described with FIG. 7C and FIG. 9B, the lamp power controlpart 10 in the rapid thermal processing apparatus of the presentembodiment is provided so that the optimum value of the balance of theirradiation intensity of the lamp group 51 for substrate heating and theirradiation intensity of the lamp group 52 for support part heating iscalculated beforehand according to the reflectivity of thelamp-irradiation-side surface of the semiconductor substrate, and as thecorrection function it is implemented in the lamp power control part 10.Based on the reflectivity of the lamp irradiation side surface of thesemiconductor substrate measured beforehand, the lamp power control part10 corrects the balance of the irradiation intensity of the lamp group51 for substrate heating and the irradiation intensity of the lamp group52 for substrate support part heating, and it is possible to keep thetemperature gradient within the surface of the substrate constantwithout depending on the reflectivity of the substrate.

FIG. 19 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the present invention.

The rapid thermal processing method of the present embodiment isapplicable when carrying out the spike annealing processing of asemiconductor substrate of a reflectivity lower than that of the siliconsubstrate.

Upon starting of the rapid thermal processing method of FIG. 19, thereflectivity of the semiconductor substrate 1 for processing isbeforehand measured within the processing chamber 2 or outside theprocessing chamber 2, and the lamp power control part 10 retains themeasured reflectivity of the semiconductor substrate 1 (S61).

Next, the lamp power control part 10 judges that the measuredreflectivity is lower than the reflectivity of the usual semiconductorsubstrate (for example, silicon substrate) (S62).

For example, when the semiconductor substrate 1 for processing is thelow reflectivity substrate which formed the nitride film of the suitablethickness for the lamp irradiation side surface of the substrate, thereflectivity R is 0.10 and it judges that it is lower than thereflectivity R=0.30 of the silicon substrate.

Next, the lamp power control part 10 corrects the setting temperature(Tset) which is the target temperature of spike annealing processingbased on the measured reflectivity R of the semiconductor substrate 1(S63).

For example, in the case of reflectivity R=0.10, the setting temperatureTset′ after the correction can be obtained by the formula Tset′=Tset+1.5degree C. using the relation of the maximum temperature of the spikeannealing processing and the reflectivity of the lamp irradiation sidesurface of the substrate shown in FIG. 3B.

Next, the lamp power control part 10 corrects the setting temperature(Tset_c) of the substrate central part, the setting temperature (Tset_m)of the substrate inner circumference part, and the setting temperature(Tset_e) of the substrate circumference part, based on the measuredreflectivity R of the semiconductor substrate 1 and the correctedsetting temperature (Tset′), respectively (S64).

For example, in the case of reflectivity R=0.10, the correction valuesof the setting temperatures of the respective regions at the time ofcorrecting the setting temperature of the semiconductor substrate of theregions heated by the lamp group in order to improve the temperaturegradient within the substrate surface when performing the spikeannealing processing of the semiconductor substrate in which the nitridefilm is formed on the lamp irradiation surface of the substrate and thereflectivity of the surface of which is 0.10 as shown in FIG. 9B are asfollows: Tset_c=Tset′, Tset_m=Tset′−1.3 degrees C., Tset_e=Tset′+3.6degrees C.

In the following control procedure, the plurality of heating lamps ofthe lamp group 51 for substrate heating are divided into three groups ofthe heating lamps for the substrate central part, the substrate innercircumference part, and the substrate circumference part of thesemiconductor substrate 1, and the lamp power control part 10 performsin parallel the lamp power control for every group.

In FIG. 19, steps S65 a-S67 a, steps S65 b-S67 b, and steps S65 c-S67 care essentially the same as the steps S53 a-S55 a, steps S53 b-S55 b,and steps S53 c-S55 c described above with FIG. 18, respectively, and adescription thereof will be omitted.

FIG. 20 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the present invention.

Upon starting of the rapid thermal processing method of FIG. 20, thereflectivity of the semiconductor substrate 1 for processing isbeforehand measured within the processing chamber 2 or outside theprocessing chamber 2, and the lamp power control part 10 retains themeasured reflectivity of the semiconductor substrate 1 (S71).

Next, the lamp power control part 10 corrects the setting temperature(Tset) which is the target temperature of the spike annealingprocessing, based on the measured reflectivity of the semiconductorsubstrate 1, and computes the setting temperature (Tset_c) of thesubstrate central part, the setting temperature (Tset_e) of thesubstrate circumference part, and the setting temperature (Tset_s) ofthe substrate support part, based on the corrected setting temperature(Tset′), respectively (S72).

In the following control procedure, the plurality of heating lamps ofthe lamp group 51 for substrate heating and the lamp group 52 forsubstrate support part heating are divided into three groups of theheating lamps for the substrate central part, for the substratecircumference part of the semiconductor substrate 1, and for thesubstrate support part 3, and the lamp power control part 10 performs inparallel the lamp power control for every group.

That is, the lamp power control part 10 monitors temperature (Tc) of thesubstrate central part by the radiation light sensors 61 a-61 d of thesubstrate central part of the semiconductor substrate 1 (S73 a).

Next, the lamp power control part 10 computes the lamp group 51 a-51 dlamp power (irradiation intensity) to heat the central part of thesemiconductor substrate 1 according to the difference of the temperature(Tc) of the substrate central part and the corrected setting temperature(Tset_c) (S74 a).

Next, the lamp power control part 10 controls the lamp group 51 a-51 dlamp power to heat the central part of the semiconductor substrate 1according to the computed lamp power (S75 a).

After the step S75 a is performed, the control is returned to the stepS73 a. Namely, while monitoring the temperature of the semiconductorsubstrate 1 by the radiation light sensor group 61 a-61 d, the feedbackcontrol to lamp group 51 a-51 d lamp power is performed according to thePID control, and the central part of the semiconductor substrate 1 isheated to the corrected target temperature (Tset_c).

In parallel to the control of the substrate central part, the lamp powercontrol part 10 monitors temperature (Te) of the substrate circumferencepart by the radiation light sensor 61 e of the substrate circumferencepart of the semiconductor substrate 1 (S73 b).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of the lamp group 51 d-51 e to heat thesubstrate circumference part of the semiconductor substrate 1 accordingto the difference of the temperature (Te) of the substrate circumferencepart and the corrected setting temperature (Tset_e) (S74 b).

Next, the lamp power control part 10 controls the lamp power of the lampgroup 51 d-51 e to heat the substrate circumference part of thesemiconductor substrate 1 according to the computed lamp power (S75 b).

After the step S75 b is performed, the control is returned to the stepS73 b. That is, while monitoring the temperature of the semiconductorsubstrate 1 by the radiation light sensor 61 e, the feedback control tothe lamp power of lamp group 51 e for substrate heating is performedaccording to the PID control, and the substrate circumference part ofthe semiconductor substrate 1 is heated to the corrected targettemperature (Tset_e).

Furthermore, in parallel to control of the substrate central part andthe substrate circumference part, the lamp power control part 10monitors temperature (Ts) of the substrate support part 3 by thetemperature monitor 62 of the substrate support part 3 (S73 c).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of the lamp group 52 to heat the substratesupport part 3 according to the difference of the temperature (Ts) ofthe substrate support part 3 and the corrected setting temperature(Tset_s) (S74 c).

Next, the lamp power control part 10 controls the lamp power of the lampgroup 52 to heat the substrate support part 3 according to the computedlamp power (S75 c).

After the step S75 c is performed, the control is returned to the stepS73 c. That is, the feedback control to the lamp power of the lamp group52 for substrate support part heating is performed according to the PIDcontrol, and the semiconductor substrate support part is heated to thecorrected target temperature (Tset_s).

As previously described with FIG. 7C and FIG. 9B, the lamp power controlpart 10 in the rapid thermal processing apparatus of the presentembodiment is provided so that the optimum value of the balance of theirradiation intensity of the lamp group 51 for substrate heating and theirradiation intensity of the lamp group 52 for support part heating iscalculated beforehand according to the reflectivity of thelamp-irradiation-side surface of the semiconductor substrate, and as thecorrection function it is implemented in the lamp power control part 10.Based on the reflectivity of the lamp irradiation side surface of thesemiconductor substrate which is measured beforehand, the lamp powercontrol part 10 corrects the balance of the irradiation intensity of thelamp group 51 for substrate heating and the irradiation intensity of thelamp group 52 for substrate support part heating, and it is possible tokeep the temperature gradient within the surface of the semiconductorsubstrate constant without depending on the reflectivity of thesemiconductor substrate.

FIG. 21 is a flowchart for explaining the rapid thermal processingmethod in the preferred embodiment of the present invention.

In FIG. 21, steps S81, S83 a, S85 a, S83 b, S85 b, S83 c, and S85 c areessentially the same as the steps S71, S73 a, S75 a, S73 b, S75 b, S73c, and S75 c described above with FIG. 20, respectively, and adescription thereof will be omitted.

In the rapid thermal processing method of FIG. 21, the lamp powercontrol part 10 corrects the PID parameter of the substrate centralpart, the substrate circumference part, and the substrate support part 3based on the measured reflectivity of the semiconductor substrate 1,respectively, after acquiring the reflectivity of the semiconductorsubstrate 1 beforehand measured at step S81 (S82).

In the following control procedure, the plurality of heating lamps ofthe lamp group 51 for substrate heating and the lamp group 52 forsubstrate support part heating are divided into three groups of theheating lamps for the substrate central part, for the substratecircumference part of the semiconductor substrate 1, and for thesubstrate support part 3, and the lamp power control part 10 performs inparallel the lamp power control for every group.

In order to avoid duplication of explanation, only a description of thelamp power control for the substrate central part of the semiconductorsubstrate 1 will be given below. As shown in FIG. 21, the lamp powercontrol of the substrate circumference part of the semiconductorsubstrate 1 and the substrate support part 3 is performed similarly.

After the computation of the temperature (Tc) of the central part of thesemiconductor substrate 1 is performed at step S83 a, the lamp powercontrol part 10 computes the lamp group 51 a-51 d lamp power(irradiation intensity) to heat the central part of the semiconductorsubstrate 1 using the corrected PID parameter according to thedifference of the temperature (Tc) of the substrate central part and thesetting temperature (Tset) (S84 a).

And, similar to the rapid thermal processing method of FIG. 14, the lampgroup 51 a-51 d lamp power to heat the central part of the semiconductorsubstrate 1 is controlled according to the computed lamp power.

Thus, the same effectiveness can be acquired even when the lamp powercontrol part 10 is provided to correct the PID parameters forcontrolling the lamp power (irradiation intensity) of the lamp group 51for substrate heating and the lamp group 52 for substrate support partheating based on the reflectivity of the semiconductor substrate 1measured beforehand, instead of correcting the setting temperature Tset.

FIG. 11A through FIG. 11J are diagrams for explaining an example of thespike annealing processing to which the rapid thermal processing methodin the preferred embodiment of the invention is applied to themanufacture method of a semiconductor device.

In order for the formation of the CMOS transistor, the spike annealingprocessing is usually performed so that thermal processing of theelevated temperature and the short time is performed for activation ofthe dopant after the ion implantation to the source/drain region.

Although a very small CMOS transistor with the size of 0.1 micrometersor less is illustrated as an example of the semiconductor device in thepresent embodiment, the present invention is not limited to this CMOStransistor but is applicable to any semiconductor device in theconfiguration of a transistor having the gate, the source and the drain.

As shown in FIG. 11A, the component active regions 103 and 104 areformed in the semiconductor substrate (for example, silicon substrate)101 which has the STI (shallow trench isolation) component separationconfiguration 102 according to the usual CMOS process.

The ion implantation of the p type impurity is made to the n typecomponent active region 103, and the ion implantation of the n typeimpurity is made to the p type component active region 104,respectively, and the p well 103 a and the n well 104 a are formed.

Then, after forming the gate insulating film 105 in each componentactive region by thermal oxidation and depositing the polysilicon filmby the CVD etc. subsequently, patterning of the polysilicon film and thegate insulating film is carried out by the photo lithography and dryetching at the electrode configuration, and the gate electrode 106 whichcomes to mind the gate insulating film is formed on the component activeregion.

Then, as shown in FIG. 11B and FIG. 11C, in order to form the resistmask 107 on which only n type component active region 103 is exposed andto form the pocket region 111 only in n type component active region 103first, the ion implantation of p type impurity (for example, indium(In)) is performed.

As the conditions for the ion implantation of In, acceleration energy isset to 30-100 keV, the amount of dose is set to 5E12/cm2-2E13/cm2, it ismade to incline from the direction perpendicular to the front surface ofthe semiconductor substrate 101, and the ion implantation is carriedout.

The slope angle (tilt angle) makes 0 degree the direction perpendicularto the substrate front surface, and makes it 0 degree-45 degrees.

In this case, the ion implantation will be respectively carried out fromthe four symmetrical directions to the substrate front surface in theacceleration energy and the amount of dose.

In the following explanation, in giving the tilt angle, it omitsexplanation as what is poured in the four directions similarly.

In addition, as an impurity, it is possible to use the boron (B) insteadof In.

In this case, acceleration energy is set to 3 keV-10 keV. Then, as shownin FIG. 11D, in order to form the extension region 113, the ionimplantation of n type impurity (for example, arsenic (As)) isperformed.

In this case, it is suitable even if it uses phosphorus (P) and theantimony (Sb) instead of As.

As ion-implantation conditions for As, acceleration energy is set to 1-5keV, the amount of dose is set to 1E14-3E15/cm2, and the tilt angle isset to 0-10 degrees.

Then, annealing processing is performed, after ashing processing etc.removes the resist mask 107, as shown in FIG. 11E.

As annealing conditions, the dwell time is set to about 0 second at 900degrees C.-1025 degrees C., and it carries out in inert-gas atmosphere,such as the nitrogen, or the atmosphere which mixed the oxygen and theinert gas 1000 ppm or less.

In this annealing processing, the reflectivity of the semiconductorsubstrate is beforehand measured within the processing chamber oroutside the processing chamber, and it is based on the measurementresult. The lamp part for substrate heating, by applying the spikeannealing processing by the rapid thermal processing method of thepresent invention characterized by correcting lamp power control of thelamp part for support part heating which carries out optical irradiationat the support part, and heats the support part.

Without being influenced by the optical physical properties of the sizeof the component separation configuration and the gate electrode, thepattern, and the various film to constitute etc., it heats correctly todesired temperature, and it becomes possible to also make thetemperature gradient within the substrate side into the minimum, and thesemiconductor device of the stable quality can be obtained.

In addition, it is also possible to take into consideration to raise theelectric activity of In which carried out the ion implantation for theformation of the pocket region 111 especially in this annealingprocessing, and to omit depending on subsequent thermal processings andadjustment of the heat process.

In addition, although illustrated in each injection process in thepresent embodiment about the case where the sidewall is not formed inthe side attachment wall of the gate electrode 106, in order to obtainthe optimal overlap of the extension region 113 and the gate electrode106, the thin sidewall 109 (refer to FIG. 11I) of the thickness of about5 nm-20 nm is formed on the both sides of the gate electrode 106, and itmay be made to perform each injection in this state.

In this case, what is necessary is not to prepare the conditionsespecially in the film composition or the configuration of the sidewall109, and just to have the function as a spacer (mask).

Then, as shown in FIG. 11F and FIG. 11G, in order to form the resistmask 108 which exposes only p type component active region 104 and toform the pocket region 114, the ion implantation of the n type impurity(for example, antimony (Sb)) is carried out.

As the conditions for the ion implantation of Sb, acceleration energy isset to 30 keV(s)-100 keV, the amount of dose is set to5E12/cm2-2E13/cm2, and the tilt angle is set to 0 degree-45 degrees.

In addition, it is possible to carry out the ion implantation instead ofSb in this case using other n type impurities, for example, As and P.

Then, as shown in FIG. 11H, in order to form the extension region 116,the ion implantation of the p type impurity (for example, boron (B)) iscarried out.

As the conditions for the ion implantation of B, the acceleration energyis set to 0.5 or less keV, the amount of dose is set to 1E14-3E15/cm2,and the tilt angle is set to 0-10 degrees.

In the case of using BF2+ for the injection ions, the conditions becomethe optimal by setting the acceleration energy to 2.5 or less keV andsetting the amount of dose to 1E14-3E15/cm2.

These optimum conditions change with the existence of the sidewall 109,or its thickness. In the case where there is the sidewall 109 as shownin FIG. 11I, it is necessary to guide energy more highly in the ionimplantation of the pocket region 114 formation, to guide the amount ofdose more highly in the ion implantation of the extension region 116formation, and to consider as the optimal conditions.

Then, as shown in FIG. 11J, the deep source/drain regions 117 and 118(deep S/D region) are formed in the component active regions 103 and104, respectively.

Specifically, after the resist mask 108 is removed by ashing processingetc., the silicon oxide film is deposited on the whole surface by theCVD etc., and remnants and the sidewall 109 are formed only in the sidesurface of each gate electrode 106 for the silicon oxide film bycarrying out anisotropy etching (etchback) of the whole surface of thissilicon oxide film.

And the resist mask which exposes only the n type component activeregion 103 is formed.

The ion implantation of the n type impurity (for example, Phosphorus(P)) is carried out to the surface of the semiconductor substrate in theboth sides of the gate electrode by using the gate electrode 106 and thesidewall 109 as the mask, and the deep S/D region 117 is formed in ntype component active region 103 exposed from this resist mask.

As the conditions for the ion implantation of P, the acceleration energyis set to 5-20 keV, the amount of dose is set to 2E15/cm2-1E16/cm2, andthe tilt angle is set to 0-10 degrees.

In addition, it is possible to be made to carry out the ion implantationof arsenic (As) instead of P.

Then, similarly, after ashing processing etc. removes the resist mask,the resist mask which exposes only p type component active region 104 isformed shortly.

And the ion implantation of the p type impurity (for example, B) iscarried out to the surface of the semiconductor substrate on the bothsides of the gate electrode by using the gate electrode 106 and thesidewall 109 as the mask, and the deep S/D region 118 is formed in ptype component active region 104 exposed from this resist mask.

As the conditions for the ion implantation of B, the acceleration energyis set to 2-5 keV, the amount of dose is set to 2E15/cm2-1E16/cm2, andthe tilt angle is set to 0 degree-10 degrees.

In the present embodiment, what is necessary is just that the ions whichcontain B, such as BF2, are used in the ion implantation of B.

And the annealing processing is performed at the target temperature of900-1050 degrees C. for the dwell time of about 0 second, and eachimpurity is activated.

In this annealing processing, the reflectivity of the semiconductorsubstrate is beforehand measured within the processing chamber oroutside the processing chamber, and it is based on the measurementresult. The lamp part for substrate heating, by applying the spikeannealing processing by the rapid thermal processing method of thepresent invention characterized by correcting lamp power control of thelamp part for support part heating which carries out optical irradiationat the support part, and heats the support part.

Without being influenced by the optical physical properties of the sizeof the component separation configuration and the gate electrode, thepattern, and the various film to constitute etc., the substrate isheated correctly to the desired temperature, and it is possible to makethe temperature gradient within the substrate surface into the minimum,and the semiconductor device of the stable quality can be obtained.

As mentioned above, in the semiconductor device of FIG. 11J, the pocketregions 111 and 114, the extension regions 113 and 116, and the deep S/Dregions 117 and 118 are formed in the semiconductor substrate 100.

The pocket region 111, the extension region 113, and the deep S/D region117 constitute the n type impurity-diffusion layer 121, while the pocketregion 114, the extension region 116, and the deep S/D region constitutethe p type impurity-diffusion layer 122.

After the annealing processing, the formation processes of theinterlayer insulation films, contact holes pore and various wiringlayers are performed, and the nMOS transistor is formed in the n typecomponent active region 103, and the pMOS transistor is formed in the ptype component active region 104, respectively.

In addition, although the case where the impurity-diffusion layer of thepair used as the source/drain was formed was illustrated in the presentembodiment after forming the gate electrode, the present invention isnot limited to this and changing such formation order suitably is alsoconsidered.

FIG. 12A and FIG. 12B show the radial distributions of the disk-shapedsemiconductor substrate of the ON state current characteristics of thenMOS transistor before and after the correction is performed by theadjustment of the lamp irradiation intensity in forming the nMOStransistor with the rapid thermal processing apparatus in the preferredembodiment as described above with FIG. 11J.

As shown in FIG. 12A and FIG. 12B, it is turned out that thedistribution of the radial direction of the ON state currentcharacteristics of the nMOS transistor before the correction is−40-+10%, and that the radial distribution of the semiconductorsubstrate of the shape of a disk of the ON state current characteristicsof the nMOS transistor after the correction by irradiation intensityadjustment of the lamp is suppressed to about −15-+12%.

When spike annealing processing is performed to the semiconductorsubstrate of a different reflectivity according to the rapid thermalprocessing apparatus of the present invention, it is turned out that themaximum temperature is kept constant, the temperature of thesemiconductor substrate and the semiconductor substrate support part iskept equal, and the effectiveness which inhibits the temperaturegradient of the circumference of the contact part with the substratesupport part and the other part is acquired.

As explained above, according to the present invention, the reflectivityof the semiconductor substrate is beforehand measured within theprocessing chamber or outside the processing chamber, and it is based onthe measurement result. The lamp part for substrate heating, bycorrecting lamp power control of the lamp part for support part heatingwhich carries out optical irradiation at the support part, and heats thesupport part.

When spike annealing processing is performed to the semiconductorsubstrate of a different reflectivity, the maximum temperature is keptconstant, the temperatures of the semiconductor substrate and thesemiconductor substrate support part are kept equal, and the temperaturegradient of the circumference of the contact part with the substratesupport part and the other part can be minimized.

FIG. 22 shows the composition of the conventional rapid thermalprocessing apparatus.

The rapid thermal processing apparatus of FIG. 22 is one of thesemiconductor fabrication machines and equipment, and it performs therapid thermal processing of a semiconductor substrate 1 while carryingout the temperature control of the semiconductor substrate 1.

This rapid thermal processing apparatus comprises the processing chamber2, and the substrate support part 3 which is arranged in the processingchamber 2 and supports the semiconductor substrate 1.

The substrate support part 3 comprises the cylindrical member 31arranged in the chamber bottom 4 rotatably through the bearing part 7,and the ring plate 32 attached to the upper end of the cylindricalmember 31. In the substrate support part 3, the level difference forsupporting the peripheral edge of the semiconductor substrate 1 isformed on the inner periphery of the ring plate 32.

The optically closed space 12 is formed on the back surface side of thesemiconductor substrate 1 in the state where the semiconductor substrate1 is supported by the ring plate 32, and this optically closed space 12is surrounded by the semiconductor substrate 1, the substrate supportpart 3 and the reflector plate 8. The reflector plate 8 is arranged atthe uppermost part of the chamber bottom 4 so that the reflector plate 4counts the back surface of the semiconductor substrate 1. This opticalclosed space 12 is provided for the temperature detection of a radiationlight from the semiconductor substrate 1 by the thermo sensors.

The lamp group 151 contains the plurality of heating lamps (151 a, 151b, 151 c, 151 d, 151 e) which optically irradiate and heat thesemiconductor substrate 1 supported by the substrate support part 3, andit is arranged above the processing chamber 2.

Moreover, the thermo-sensor group 161 contains the plurality of thermosensors (161 a, 161 b, 161 c, 161 d, 161 e) which receive the radiationlight from the semiconductor substrate 1, and it is arranged in thechamber bottom 4.

Each thermo sensor of the thermo-sensor group 161 is configured in theposition corresponding to one of the different radial positions of thesemiconductor substrate 1, respectively, and outputs the measurementresult (sensor output signal) of one of the radial positions of thesemiconductor substrate 1 to the temperature computing part 9.

The temperature computing part 9 acts as the monitor of the outputsignal from each thermo sensor of the thermo-sensor group 161, andcomputes the temperature of the semiconductor substrate 1 based on theradiation light from the semiconductor substrate 1 which light isdetected by each thermo sensor.

The lamp power control part 10 controls the irradiation intensity ofeach heating lamp of the lamp group 151, arranged above thesemiconductor substrate 1, based on the substrate temperature computedby the temperature computing part 9.

Next, the operation of the rapid thermal processing apparatus of anotherpreferred embodiment of the invention will be explained with referenceto FIG. 23A and FIG. 23B.

FIG. 23A and FIG. 23B are diagrams for explaining the irradiation lightwhich is received by the thermo sensor in the rapid thermal processingapparatus of the present embodiment when the lamps are turned on andoff.

In FIG. 23A and FIG. 23B, reference numeral 111 denotes the radiationlight from the semiconductor substrate 1, 112 denotes the emission lightwhich penetrated the semiconductor substrate 1 and arrived at theoptical closed space 12 on the back surface side of the semiconductorsubstrate 1, 113 denotes the reflected light which was reflected by thefront surface of the semiconductor substrate 1, and 121 denotes theemitted radiation light of the lamp group 151 for substrate heating,respectively.

FIG. 23A shows the light which is received by the thermo sensor 161 atthe time of lamp lighting (ON) of the rapid thermal processingapparatus, and FIG. 23B shows the light which is received by the thermosensor 161 at the time of lamp lighting off (OFF) of the rapid thermalprocessing apparatus. The dotted line arrows in FIG. 23B indicate thatthe light at the time of lamp lighting is eliminated at the time of lamplighting off.

As described above, the irradiation intensity of each lamp of the lampgroup 151 is controlled by the temperature computing part 9 and the lamppower control part 10 with the rapid thermal processing apparatus of thepresent invention based on the measurement result of the thermo-sensorgroup 161.

As shown in FIG. 23A, the light which the thermo sensor 161 receives atthe time of lamp lighting (ON) is the radiation light 11 from thesemiconductor substrate 1 and the emission light 112 which penetratedthe semiconductor substrate 1.

For example, when heating the semiconductor substrate with low carrierconcentration (the substrate resistance: 1 m-ohm-cm-1 k-ohm-cm; thethickness of 300-mm diameter wafer: 750-800 micrometers; the thicknessof 200-mm diameter wafer: 700-750 micrometers) in the state where thesubstrate temperature is low, the light from the heating lamp willpenetrate the semiconductor substrate 1 and will reach the thermo sensorfor receiving the radiation light from the semiconductor substrate sincethe light shading characteristic of the near-infrared light region islow. For this reason, exact temperature of the semiconductor substratecannot be measured.

Therefore, in such a case, the control of the irradiation intensity ofeach lamp by using the temperature computing part 9 and the lamp powercontrol part 10 will become inaccurate.

In order to overcome the problem of the conventional rapid thermalprocessing apparatus previously described with FIG. 24, in the rapidthermal processing apparatus of the present embodiment, the heatinglamps for heating the semiconductor substrate are turned onintermittently, and the irradiation intensity of each lamp of the lampgroup 151 is controlled according to the optical intensity which iscomputed based on the light received by the thermo sensor at the time ofturning off the heating lamps.

As shown in FIG. 23B, the light which the thermo sensor 161 receives atthe time of lamp lighting off (OFF) is only the radiation light 111 fromthe semiconductor substrate 1, and since the influence of the emissionlight 112 which penetrated the semiconductor substrate 1 to the outputsignal of the thermo sensor 161 can be discard almost at this time, itis possible to attain highly precise control of the heating of thesemiconductor substrate.

FIG. 28 is a flowchart for explaining the control procedure of the rapidthermal processing method in the preferred embodiment of the invention.

FIG. 29 is a diagram for explaining the time transition of the lampintensity and the thermo-sensor output in the rapid thermal processingmethod of FIG. 28.

The rapid thermal processing method of the present embodiment is carriedout when the lamp power control part 10 of the rapid thermal processingapparatus of FIG. 22 performs the control procedure of FIG. 28, and itis possible to attain measurement of exact substrate temperature, andhighly accurate control of the heating of the semiconductor substrateeven in the state where the temperature of the semiconductor substrateis low and the light shading characteristic is low.

A description will be given of the rapid thermal processing method ofthe present embodiment with reference to FIG. 28 and FIG. 29. For thesake of convenience of description, it is assumed that only one pair ofheating lamp 151 and thermo sensor 161 is provided in the rapid thermalprocessing apparatus of FIG. 22.

However, even in the case where the plurality of pairs including theplurality of heating lamps 151 and the plurality of thermo sensors 161are provided in the rapid thermal processing apparatus as shown in FIG.22, what is necessary is just to repeat the execution of the controlprocedure that is the same as that of FIG. 28 for each of the pluralityof pairs.

The control procedure of FIG. 28 is provided for the lamp power controlpart 10 to specifically perform intermittent irradiation mode in whichthe heating lamp 151 is turned on intermittently, which is implementedapart from the continuous-irradiation mode in which the heating lamp 151is irradiated continuously, which is normally performed by the lamppower control part 10.

Upon starting of the intermittent irradiation mode, the lamp powercontrol part 10 sets up the lamp intensity suitable as an initial valueof the electrical voltage applied to the heating lamp 151 (S101).

Next, the lamp power control part 10 turns on the heating lamp 151 for afixed time (ON), and acquires the substrate temperature which iscomputed by the temperature computing part 9 based on the output signalTon outputted from the thermo sensor 161 at this time (S102). However,the output signal Ton of the thermo sensor 161 at this time is discardedwithout being used for the lamp power control.

Next, the lamp power control part 10 turns off the heating lamp 151(OFF) (S103).

And the lamp power control part 10 discards the output signal from thethermo sensor 161 until the predetermined time dt has elapsed (S104).This time dt is determined beforehand by experiment as being the periodof time from the instant the heating lamp 151 is turned off to theinstant the emission light which penetrated the semiconductor substrate1 stops reaching the thermo sensor 161.

As shown in FIG. 29, the time of lamp lighting (ON) in step S102corresponds to the time of a rise in the waveform of the lamp powercontrol pulse, and the time of lamp lighting off (OFF) in step S103corresponds to the time of a fall in the waveform of the lamp powercontrol pulse. The output of the thermo sensor 161 increases rapidlyfrom the instant of lamp lighting, and decreases rapidly from theinstant of lamp lighting off. In the step S104, while the predeterminedtime dt passes, the lamp power control part 10 discards the outputsignal of the thermo sensor 161. That is, the output of the thermosensor 161 in the state of decreasing rapidly during the period of thepredetermined time dt is discarded.

Next, the lamp power control part 10 acquires the substrate temperaturewhich is computed by the temperature computing part 9 based on theoutput signal Toff of the thermo sensor 161 after the progress of thepredetermined time dt (S105).

Next, the lamp power control part 10 determines whether the temperaturedifference between the substrate temperatures Ton and Toff, which aremonitored at the step S102 and the step S105, is smaller than thepredetermined threshold (S106).

The temperature difference of the substrate temperatures (Ton and Toff)is equivalent to the cooling of the semiconductor substrate due to theswitching off of the heating lamp 151. That is, the determination ofstep S106 is to judge whether the emission light which penetrated thesemiconductor substrate 1 becomes sufficiently small when compared tothe radiation light from the semiconductor substrate 1.

As is described latex, it is necessary to predetermine the threshold bythe measurement result using the rapid thermal processing apparatus ofthe present embodiment.

When it is determined at step S106 that the temperature difference ofthe substrate temperatures (Ton and Toff) is almost equal to or smallerthan the predetermined threshold, the lamp power control part 10terminates the intermittent irradiation mode. The control is transferredto the continuous-irradiation mode (S107).

At this time, it is judged that the emission light which penetrated thesemiconductor substrate 1 has become sufficiently small when comparedwith the radiation light from the semiconductor substrate 1.

In the continuous-irradiation mode, the lamp power control part 10performs the lamp power control on real time according to the known PIDcontrol, which is previously described.

When it is determined at step S106 that the temperature difference ofthe substrate temperatures (Ton and Toff) is still larger than thepredetermined threshold, the lamp power control part 10 sets up the lampintensity for the time of next irradiation of the heating lamp based onthe difference of the substrate temperature (Toff) and the settingtemperature (Tset) (S108).

The setting temperature (Tset) is the predetermined target temperaturefor heating the semiconductor substrate 1, and the lamp power controlpart 10 controls at step S108 the irradiation intensity of the lamp part151 according to the substrate temperature (Toff) acquired at step S105.

The lamp power control part 10 repeats the above control procedure(S102-S106) after the step S108 is performed (refer to FIG. 29).

In the present embodiment, the setting temperature (Tset) is the targettemperature of the substrate being heated at a certain time and it isvariable.

In the case of the semiconductor substrate with low transmittance (orthe substrate with high carrier concentration), if the temperaturedifference of the substrate temperatures (Ton and Toff) is small enoughat the first cycle in the time transition of FIG. 29, it is necessary totransfer the control to the continuous-irradiation mode at the nextcycle even when the substrate temperature (Toff) is lower than thesetting temperature (Tset). Namely, controlling the lamp power based onthe difference of the substrate temperature (T) and the settingtemperature (Tset) in the continuous-irradiation mode is needed.

On the other hand, in the case of the semiconductor substrate with hightransmittance (or the substrate with low carrier concentration), if thetemperature difference of the substrate temperatures (Ton and Toff) islarger than the threshold even when the substrate temperature (Toff) ishigher than the setting temperature (Tset), it is necessary to continuethe intermittent irradiation mode. Namely, controlling the lamp powerbased on only the substrate temperature (Toff) in the intermittentirradiation mode is needed.

According to the rapid thermal processing apparatus of the presentembodiment, by turning on the heating lamp intermittently, the emissionlight which penetrates the semiconductor substrate can be discardedduring the turning off of the heating lamp, and the thermo sensor canreceive only the radiation light from the semiconductor substrate.

Therefore, according to the rapid thermal processing apparatus of thepresent embodiment, the temperature measurement of the semiconductorsubstrate can be correctly performed by the temperature calculationaccording to the output result of the thermo sensor at this time.

In this case, since only the radiation light from the semiconductorsubstrate at the time of putting out lights of the heating lamp isdetected directly, only the error of the thermo sensor itself isproduced.

For this reason, thermometry highly precise than the conventional rapidthermal processing apparatus becomes possible.

FIG. 25 and FIG. 26 show time transition of the average of thetemperature which each thermo sensor detected, and time transition ofthe temperature which each thermo sensor detected separately, when theshading characteristic of the near infrared region is in the state wheresubstrate temperature is low, performs intermittent irradiation mode ofthe rapid thermal processing apparatus of the present embodiment in atentative way and repeats lighting and putting out lights of the heatinglamp to the semiconductor substrate with low transmittance.

The resistance of the semiconductor substrate used in the example ofFIG. 25 and FIG. 26 is 10-ohmcm, and thickness is 725 micrometers.

Moreover, the tungsten halogen lamp was used as a heating lamp of thelamp group 151 arranged by the rapid thermal processing apparatus.

As shown in FIG. 25 and FIG. 26, in intermittent irradiation mode,optical irradiation by 30% of the maximum irradiation intensity for 2seconds and the subsequent optical irradiation by 5% of the maximumirradiation intensity for 1 second are repeated one or more times.

In the optical irradiation by 5% of the maximum irradiation intensity,it is confirmed that the light from the heating lamp does not penetratethe semiconductor substrate and does not reach the thermo sensor.

Time transition of the average of the temperature which the five thermosensors arranged in the back surface side of the semiconductor substratedetected is shown in the example of FIG. 25.

It takes a certain time to cut off the emission light from the tungstenhalogen lamp fully by dropping the lamp power of the heating lamp to 5%because the temperature of the filament of the tungsten halogen lampdoes not fall instantaneously even if the lamp power of the heating lampis lowered.

Therefore, when turning on the heating lamp intermittently the period ofthe light-off must be longer than the time needed for cutting off theemission light from the tungsten halogen lamp fully by dropping the lamppower of the heating lamp.

The temperature values which are detected by the five thermo sensorsarranged on the back surface side of the semiconductor substrate areindividually shown in the example of FIG. 26 (T1, T2, T3, T4, T5).

Although the temperature gradient of the five points from which itdiffers within the field of the semiconductor substrate seems to be lessthan 30 degrees C. at the temperature on appearance when the heatinglamp is on as shown in FIG. 26, the in-surface temperature gradientamounts to 60 degrees C. or more at the temperature at the time ofputting out lights of the heating lamp.

It is possible to minimize the temperature gradient within thesemiconductor substrate by controlling the irradiation intensity of theheating lamp according to the substrate temperature based on theirradiation light from the substrate separated from the light detectedby the irradiation light sensors with eliminating the emission lightwhich penetrates the substrate.

FIG. 27A and FIG. 27B are diagrams for explaining the time transition ofthe temperature of the semiconductor substrate during the naturalcooling in the processing chamber from the time of turning off thelamps.

FIG. 27A shows the time transition of the temperature which is detectedby each thermo sensor separately for 25 seconds after the start ofexecution of the intermittent irradiation mode of FIG. 26. In theintermittent irradiation mode, the heating lamps are set alternately inthe lighting-on state or in the lighting-off state. FIG. 27B shows thetime transition of the temperature which is detected by each thermosensor separately for 25 seconds during the cooling of the semiconductorsubstrate at about 330-340 degrees C. in the processing chamber in thestate where the irradiation intensity of the heating lamp is set up to5%.

The fall of the apparent temperature in the lighting-off state of theheating lamps when the substrate temperature of FIG. 27A is in thetemperature range below 300 degrees C. is very quick compared with thetemperature fall during the natural cooling of the substrate where theirradiation intensity of the heating lamps is set up to 5%. Thisindicates that most of the showing results in by the elimination of theinfluence of the penetrated light.

The ramp-down rate of the substrate temperature when the irradiationintensity of the heating lamps is set to 5% of the maximum irradiationintensity at 21 seconds after the start of execution of the intermittentirradiation mode of FIG. 27A is almost equivalent to the ramp-down rateof the substrate temperature during the natural cooling of the substratewhere the irradiation intensity of the heating lamps is set up to 5%. Itmeans that the light shading characteristic of the semiconductorsubstrate changes at this instant into the state where the penetratedlight is sufficiently small when compared with the radiation light fromthe semiconductor substrate, and it is negligible.

Therefore, after this instant (21 seconds after), the temperature of thesemiconductor substrate can be measured correctly even if theintermittent irradiation mode is not continued, and it is desirable totransfer to the continuous irradiation mode after this instant.

The above-described threshold which is used at step S106 of the controlprocedure of FIG. 28 can be obtained as in the following. The timetransition of the substrate temperature as in the example of FIG. 27B isobtained experimentally using the rapid thermal processing apparatus byadequately lowering the irradiation intensity of the heating lamps forthe semiconductor substrate in the processing chamber or setting thestate where the heating lamps is turned off completely. What isnecessary is just to find the ramp-down rate of the temperature of thesemiconductor substrate in the period of time (dt) from the instant ofswitching off of the heating lamps to the instant the light whichpenetrated the semiconductor substrate stops reaching the thermo sensor,as a function of the substrate temperature based on the above timetransition, and just to set up as the above-mentioned threshold based onthe function of the substrate temperature.

According to the above-described embodiment, even when the light shadingcharacteristic of the semiconductor substrate is inadequate, the heatinglamps are turned on intermittently as explained above, and the substratetemperature is obtained according to the optical intensity which isreceived by the thermo sensor during the lighting-off state of theheating lamps. Hence, it is possible to eliminate the influence of thepenetrated light and to measure the substrate temperature correctly.Moreover, even when the temperature of the semiconductor substrate islow, it is possible to control correctly the substrate temperature bycontrolling the irradiation intensity of the heating lamps based on thesubstrate temperature measured.

Next, a description will be given of another preferred embodiment of theinvention.

FIG. 30 is a flowchart for explaining the control procedure of the rapidthermal processing apparatus in the preferred embodiment of the presentinvention.

The control procedure of FIG. 30 is performed by the lamp power controlpart 10 in the rapid thermal processing apparatus of this embodiment.

In the control procedure of FIG. 30, the temperature computing part 9computes, the temperature (Te) of the substrate circumferential partbased on the radiation light from the semiconductor substrate detectedby the radiation light sensors 61 e and 61 d (S231).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of the lamp groups 51 e and 51 d which heat thesubstrate circumference part, according to the difference of thetemperature Te of the substrate circumference part which is computed bythe temperature computing part 9 and the predetermined settingtemperature Tset (S232).

Next, the lamp power control part 10 controls the lamp power of the lampgroups 51 d and 51 e which heat the substrate circumference partaccording to the computed lamp power (S233).

After the step S233 is performed, the control is returned to the stepS231. That is, monitoring the temperature of the semiconductor substrateby the radiation light sensor on real time, the feedback control to thelamp power for heating is performed according to the known PID control,and the semiconductor substrate is heated to the desired targettemperature (Tset) using the heating lamps.

In parallel to the above control procedure, the temperature computingpart 9 computes the temperature (Ts) of the substrate support part 3based on the radiation light from the substrate support part detected bythe radiation light sensor 62 for the support part (S234).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of the lamp groups 52 and 51 e which heat thesubstrate support part 3, according to the difference of the temperature(Ts) of the substrate support part 3 computed by the temperaturecomputing part 9 and the predetermined setting temperature (Tset)(S235).

Next, the lamp power control part 10 controls the lamp power of the lampgroups 52 and 51 e which heat the substrate circumference part and thesubstrate support part 3, according to the computed lamp power (S236).

After the step S236 is performed, the control is returned the step S234.That is, monitoring the temperature of the semiconductor substrate bythe radiation light sensor 62 for the support part on real time, thefeedback control to the lamp power for heating is performed according tothe known PID control, and the substrate support part is heated to thedesired target temperature (Tset) using the lamp group 52 for supportpart heating and the lamp group 51 e for substrate heating.

In the preferred embodiment, the lamp power of the lamp groups 51 e and51 d which heat the substrate circumference part is controlled based ononly the temperature Te of the substrate circumference part at stepS232. Alternatively, it is possible to perform the feedback of not onlythe temperature Te of the substrate circumference part but also thetemperature Ts (temperature value acquired at step S234) of thesubstrate support part 3 to control the lamp power of the lamp groups 51e and 51 d which heat the substrate circumference part.

Moreover, in order to control the lamp power of the lamp groups 52 and51 e which heat the substrate support part 3 at step S235, it ispossible to feed back not only the temperature Ts of the substratesupport part 3 but the temperature Te of the substrate circumferencepart (temperature value acquired at step S231).

FIG. 31 is a flowchart for explaining the control procedure of theconventional rapid thermal processing apparatus in the case ofheat-treating the silicon substrate.

The control procedure of FIG. 31 is performed by the lamp power controlpart 10 in the conventional rapid thermal processing apparatus.

In the present embodiment, the surface reflectivity R of the siliconsubstrate is equal to approximately 0.30, and the control procedure ofFIG. 31 assumes the case where the silicon substrate is heat-treated.

Upon starting of the control procedure of FIG. 31, the lamp powercontrol part 10 of the conventional rapid thermal processing apparatusis optimized so that the lamp power of lamp group 51 d and 51 e whichheat the substrate circumference part and the substrate support part 3to which the temperature gradient of the substrate circumference partand the substrate support part becomes small to the silicon substrate,may be computed (S211).

Next, the temperature computing part 9 computes temperature Te of thesubstrate circumference part from the radiation light from thesemiconductor substrate detected by the radiation light sensors 61 d and61 e (S212).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of lamp group 51 e and 51 d to heat thesubstrate circumference part and the substrate support part 3 accordingto the difference of the temperature Te of the substrate circumferencepart computed by the temperature computing part 9 and the predeterminedsetting temperature Tset (S213).

Next, the lamp power control part 10 controls the lamp power of lampgroup 51 e and 51 d to heat the substrate circumference part and thesubstrate support part 3 according to the computed lamp power (S214).

Since the lamp power control part 10 is optimized in advance so that thelamp power of the lamp groups 51 d and 51 e which make small thetemperature gradient of the substrate circumference part and thesubstrate support part 3 can be computed to the silicon substrate, thetemperature of the substrate support part approaches the temperature ofthe semiconductor substrate.

After the step S214 is performed, the control is returned to the stepS212. That is, monitoring the temperature of the semiconductor substrateby the radiation light sensors 61 e and 61 d on real time, according tothe known PID control, feedback control to the lamp power for heating isperformed, and it heats to the target temperature (Tset) of the requestof the substrate circumference part and the substrate support part bythe lamp group 51 e and 51 d.

FIG. 32 is a flowchart for explaining the control procedure of theconventional rapid thermal processing apparatus in the case of carryingout spike annealing processing of the low reflectivity semiconductorsubstrate (for example, semiconductor substrate which formed the nitridefilm of the suitable thickness for the lamp irradiation side surface).

The control procedure of FIG. 32 is performed by the lamp power controlpart 10 in the conventional rapid thermal processing apparatus.

In the present embodiment, the surface reflectivity R of the lowreflectivity substrate is equal to approximately 0.10, and isreflectivity lower than the silicon substrate.

The control procedure of FIG. 32 assumes the case where the lamp powercontrol part 10 is optimized to spike annealing processing of thesilicon substrate in the conventional rapid thermal processingapparatus.

In the control procedure of FIG. 32, first, the lamp power control part10 of the conventional rapid thermal processing apparatus is optimizedso that the lamp power of lamp group 51 e and 51 d which heat thesubstrate circumference part and the substrate support part to which thetemperature gradient of the substrate circumference part and thesubstrate support part becomes small to the silicon substrate, may becomputed (S221).

Next, the temperature computing part 9 computes temperature Te of thesubstrate circumference part from the radiation light from thesemiconductor substrate detected by the radiation light sensors 61 d and61 e (S222).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of lamp group 51 e and 51 d to heat thesubstrate circumference part and the substrate support part 3 accordingto the difference between the temperature Te of the substratecircumference part computed by the temperature computing part 9 and thepredetermined setting temperature Tset (S213).

In the present embodiment, since the low reflectivity substrate has thehigh absorption rate of light compared with the silicon substrate, thelamp power control part 10 brings the temperature of the substratecircumference part close to the setting temperature Tset by lowering thelamp power (irradiation intensity) of lamp group 51 e and 51 d whichheat the substrate circumference part and the substrate support part 3(S223).

Next, the lamp power control part 10 controls the lamp power of lampgroup 51 e and 51 d which heat the substrate circumference part and thesubstrate support part 3 according to the computed lamp power.

In the present embodiment, since the absorption rate of light of thesubstrate support part 3 is fixed, the temperature of the substratesupport part 3 becomes lower than the setting temperature Tset due tothe decrease of the lamp power (irradiation intensity) of the lamp group51 e to heat the substrate circumference part and the substrate supportpart.

Since the temperature of the substrate circumference part approaches thesetting temperature Tset, the difference arises to the temperature ofthe substrate circumference part and the substrate support part as aresult (S224).

After the step S224 is performed, the control is returned to the stepS222. That is, monitoring the temperature of the semiconductor substrateby the radiation light sensors 61 e and 61 d on real time, according tothe known PID control, feedback control to the lamp power for heating isperformed, and it heats to the target temperature (Tset) of the requestof the substrate circumference part and the substrate support part byusing the lamp group 51 e and 51 d.

FIG. 33 is a flowchart for explaining the control procedure of the rapidthermal processing apparatus in the preferred embodiment of the presentinvention in the case of carrying out the spike annealing processing ofthe low reflectivity substrate. The low reflectivity substrate is, forexample, a semiconductor substrate in which the nitride film is formedwith a suitable thickness on the lamp-irradiation-side surface thereof.

The control procedure of FIG. 33 is performed by the lamp power controlpart 10 in the rapid thermal processing apparatus of this embodiment.

Upon starting of the control procedure of FIG. 33, the temperaturecomputing part 9 computes the temperature Te of the substratecircumference part from the radiation light from the semiconductorsubstrate detected by the radiation light sensors 61 e and 61 d (S241).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of the lamp group 51 d and the lamp group 51 ewhich heat the substrate circumference part and the substrate supportpart, according to the difference of the temperature Te of the substratecircumference part computed by the temperature computing part 9 and thepredetermined setting temperature Tset (S242).

In the present embodiment, the low reflectivity substrate has the highabsorption rate of light compared with the silicon substrate, and thelamp power control part 10 brings the temperature of the substratecircumference part close to the setting temperature Tset by lowering thelamp power (irradiation intensity) of the lamp group 51 e and 51 d whichheat the substrate circumference part and the substrate support part 3below that in the case of the silicon substrate.

Next, the lamp power control part 10 controls the lamp power of the lampgroup 51 e and 51 d which heat the substrate circumference part and thesubstrate support part 3 according to the computed lamp power (S243).

After the step S243 is performed, the control is returned to the stepS241. That is, monitoring the temperature of the semiconductor substrateby the radiation light sensors 61 e and 61 d on real time, according tothe known PID control, the feedback control to the lamp power forheating is performed and the substrate circumference part and thesubstrate support part 3 are heated to the desired target temperature(Tset) by the lamp group 51 e and 51 d.

In parallel to the above control procedure, the temperature computingpart 9 computes the temperature Ts of the substrate support part 3 basedon the radiation light from the substrate support part detected by thesupport-part radiation light sensor 62 (S244).

Next, the lamp power control part 10 computes the lamp power(irradiation intensity) of the lamp groups 52 and 51 e which heat thesubstrate support part 3, according to the difference of the temperatureTs of the substrate support part 3 computed by the temperature computingpart 9 and the predetermined setting temperature Tset (S245).

In the present embodiment, since low reflectivity substrate has the highabsorption rate of light compared with the silicon substrate, and thelamp power control part 10 brings the temperature of the substratecircumference part close to the setting temperature Tset by lowering thelamp power (irradiation intensity) of the lamp group 51 e and 51 d whichheat the substrate circumference part and the substrate support part 3below that in the case of the silicon substrate.

Since the reflectivity of the substrate support part is fixed, the fallof the temperature of the substrate support part 3 due to the fall ofthe lamp power of the lamp group 51 e to heat the substratecircumference part and the substrate support part is detected by thesupport-part radiation light sensor 62. The lamp power control part 10functions to raise the lamp power (irradiation intensity) of the lampgroup 52 to heat the substrate support part 3, above that in the case ofthe silicon substrate according to the computed temperature Ts to bringthe temperature of the substrate support part 3 close to the settingtemperature Tset (S246). The lamp power control part 10 controls thelamp power of the lamp group 52 to heat the substrate support part 3according to the computed lamp power.

After the step S246 is performed, the control is returned to the stepS244. That is, monitoring the temperature of the substrate support part3 using the radiation light sensor 52 on real time, the feedback controlto the lamp power for heating is performed according to the known PIDcontrol, and the substrate support part 3 is heated to the desiredtarget temperature (Tset) by using the lamp group 52 to heat thesubstrate support part 3.

In the above-described embodiment, the temperature of the semiconductorsubstrate and the temperature of the substrate support part are keptequal, to suppress the temperature gradient of the substratecircumference part of the semiconductor substrate in contact with thesubstrate support part and the other part from increasing.

Alternatively, when there is the difference in temperature between thecontact area of the substrate circumference with the substrate supportpart and the area of the substrate circumference part the temperature ofwhich is monitored by the radiation light sensor 61 e, it becomespossible to decrease the temperature gradient of the substratecircumference part in contact with the substrate support part and theother part by correcting the setting temperature of the substratesupport part according to the difference in temperature.

As explained above, according to the rapid thermal processing apparatusof the present embodiment, the temperature of the semiconductorsubstrate is measured, and the irradiation intensity of the lamp partfor heating the substrate surface is controlled based on the substratetemperature measured. Moreover, the temperature of the substrate supportpart is measured, and the irradiation intensity of the lamp part forheating the substrate support part is controlled based on the supportpart temperature measured.

Even in the case where the semiconductor substrate of a differentreflectivity is heated, the temperature of the semiconductor substrateand the temperature of the substrate support part can be kept equal, andthe temperature gradient of the circumference part of the semiconductorsubstrate in contact part with the substrate support part and the otherpart can be inhibited from increasing. Therefore, when the semiconductorsubstrate of an arbitrary reflectivity is subjected to the rapid thermalprocessing, it is possible to perform the temperature control with highaccuracy.

The present invention is not limited to the above-described embodiments,and variations and modifications may be made without departing from thescope of the present invention.

1-9. (canceled)
 10. A method of manufacture of a semiconductor devicefor performing a rapid thermal processing of a semiconductor substrateusing a rapid thermal processing apparatus which comprises a processingchamber subjecting a semiconductor substrate to rapid thermalprocessing, a substrate support part arranged in the processing chamberand supporting the substrate, a lamp part optically irradiating thesubstrate supported by the substrate support part and heating thesubstrate, a thermo sensor provided to measure a temperature of thesubstrate, a temperature computing part computing the temperature of thesubstrate based on an output signal of the thermo sensor, and a controlpart controlling an irradiation intensity of the lamp part according tothe temperature computed by the temperature computing part, the methodof manufacture of the semiconductor device comprising the steps of:performing the rapid thermal processing of the substrate; and correctinga control parameter of the irradiation intensity of the lamp part basedon a reflectivity of a surface of the substrate which is measuredbeforehand.
 11. A method of manufacture of a semiconductor device forperforming a rapid thermal processing of a semiconductor substrate usinga rapid thermal processing apparatus which comprises a processingchamber subjecting a semiconductor substrate to rapid thermalprocessing, a substrate support part arranged in the processing chamberand supporting the substrate, a substrate lamp part opticallyirradiating a front surface of the substrate supported by the substratesupport part and heating the substrate, a support-part lamp partoptically irradiating and heating the substrate support part, areflector plate arranged on a back surface side of the substrate andreflecting a radiation light from the substrate back surface, aplurality of radiation light sensors arranged on the side of the backsurface of the substrate and receiving a radiation light from thesubstrate back surface subjected to multiple reflection between thesubstrate back surface and the reflector plate, an emissivity sensorreceiving directly a radiation light from the substrate back surface, anemissivity computing part computing an emissivity of the back surface ofthe substrate based on output signals of the plurality of radiationlight sensors and an output signal of the emissivity sensor, asupport-part radiation light sensor receiving directly a radiation lightfrom the substrate support part, a temperature computing part computinga temperature of the substrate based on the output signals of theplurality of radiation light sensors and an output signal of theemissivity computing part, and computing a temperature of the substratesupport part based on an output signal of the support-part radiationlight sensor, and a control part controlling an irradiation intensity ofeach of the substrate lamp part and the support-part lamp part accordingto a temperature computed by the temperature computing part, the methodof manufacture of the semiconductor device comprising the steps of:performing the rapid thermal processing of the substrate so that thecontrol part controls the irradiation intensity of the substrate lamppart according to a temperature of the substrate computed by thetemperature computing part and controls the irradiation intensity of thesupport-part lamp part according to a temperature of the substratesupport part computed by the temperature computing part; and correctingboth a control parameter of the irradiation intensity of the substratelamp part and a control parameter of the support-part lamp part,respectively, based on a reflectivity of the front surface of thesubstrate which is measured beforehand.
 12. (canceled)
 13. The method ofmanufacture of the semiconductor device according to claim 11 whereinthe reflectivity of the front surface of the substrate is measuredbeforehand within the processing chamber in a state before the substrateis heated in the processing chamber to reach a desired targettemperature, and the control parameter of the irradiation intensity iscorrected based on the measured reflectivity.
 14. The method ofmanufacture of the semiconductor device according to claim 11 whereinthe reflectivity of the front surface of the substrate is measuredbeforehand as being a value of the irradiation intensity of the lamppart needed to retain the substrate at a first temperature lower than adesired target temperature for a fixed time in a state where thesubstrate is heated in the processing chamber for the fixed time at the1st temperature, and the control parameter of the irradiation intensityis corrected based on the value of the irradiation intensity.
 15. Themethod of manufacture of the semiconductor device according to claim 11wherein the control parameter of the irradiation intensity is correctedbased on a correlation between the reflectivity of the substrate frontsurface which is measured beforehand and a difference in a maximumtemperature of the substrate and the substrate support part.
 16. Themethod of manufacture of the semiconductor device according to claim 11wherein a balance of the irradiation intensity of the substrate lamppart and the irradiation intensity of the support-part lamp part iscorrected based on a correlation between the reflectivity of the frontsurface of the substrate which is measured beforehand and a balance ofthe irradiation intensity of the substrate lamp part and the irradiationintensity of the support-part lamp part when a difference in thetemperature between the substrate and the substrate support part isminimum.
 17. The method of manufacture of the semiconductor deviceaccording to claim 11 wherein the reflectivity of the front surface ofthe substrate is measured beforehand outside the processing chamber. 18.A rapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportingthe substrate; a lamp part optically irradiating a front surface of thesubstrate supported by the substrate support part and heating thesubstrate; a thermo sensor arranged on a back surface side of thesubstrate and receiving a radiation light from the substrate; atemperature computing part computing a temperature of the substratebased on an output signal of the thermo sensor; and a control partcontrolling an irradiation intensity of the lamp part according to thetemperature of the substrate computed by the temperature computing part,wherein the control part is provided to turn on the lamp partintermittently and to control the irradiation intensity of the lamp partaccording to a temperature of the substrate computed by the temperaturecomputing part based on a radiation light which is received by thethermo sensor when the lamp part is turned off.
 19. The rapid thermalprocessing apparatus according to claim 18 wherein the control partdiscards, when controlling the irradiation intensity of the lamp part,the temperature of the substrate computed based on a radiation lightwhich is received by the thermo sensor when the lamp part is turned on.20. The rapid thermal processing apparatus according to claim 18 whereinthe control part terminates an intermittent irradiation of the lamp partif a difference between the substrate temperature computed based on theradiation light received by the thermo sensor when the lamp part isturned on and the substrate temperature computed based on the radiationlight received by the thermo sensor when the lamp part is turned off isless than a predetermined threshold, and starts a continuous irradiationof the lamp part in which the control part controls the irradiationintensity of the lamp part according to the substrate temperaturecomputed based on the radiation light received by the thermo sensor whenthe lamp part is turned on.
 21. A method of rapid thermal processing ofa semiconductor substrate using a rapid thermal processing apparatuswhich comprises a processing chamber subjecting the substrate to rapidthermal processing, a substrate support part arranged in the processingchamber and supporting the substrate, a lamp part optically irradiatinga front surface of the substrate supported by the substrate support partand heating the substrate, a thermo sensor arranged on a back surfaceside of the substrate and receiving a radiation light from thesubstrate, a temperature computing part computing a temperature of thesubstrate based on an output signal of the thermo sensor, and a controlpart controlling an irradiation intensity of the lamp part according tothe temperature of the substrate computed by the temperature computingpart, the method comprising the steps of: performing an intermittentirradiation of the lamp part by turning on the lamp part intermittently;acquiring a first substrate temperature computed based on an outputsignal of the thermo sensor when the lamp part is turned on; acquiring asecond substrate temperature computed based on an output signal of thethermo sensor when the lamp part is turned off; and controlling theirradiation intensity of the lamp part according to the second substratetemperature when a difference between the first substrate temperatureand the second substrate temperature is larger than a predeterminedthreshold.
 22. The method according to claim 21 wherein the intermittentirradiation step, the first substrate temperature acquiring step, andthe second substrate temperature acquiring step are repeated until thedifference between the first substrate temperature and the secondsubstrate temperature is less than the predetermined threshold.
 23. Themethod according to claim 21 further comprising the steps of:terminating the intermittent irradiation of the lamp part if thedifference between the first substrate temperature and the secondsubstrate temperature is less than the predetermined threshold; andstarting a continuous irradiation of the lamp part in which the controlpart controls the irradiation intensity of the lamp part according tothe first substrate temperature computed based on the radiation lightreceived by the thermo sensor when the lamp part is turned on.
 24. Arapid thermal processing apparatus comprising: a processing chambersubjecting a semiconductor substrate to rapid thermal processing; asubstrate support part arranged in the processing chamber and supportsthe substrate; a lamp part optically irradiating a front surface of thesubstrate supported by the substrate support part and heating thesubstrate; a thermo sensor arranged on aback surface side of thesubstrate and receiving a radiation light from the substrate; atemperature computing part computing a temperature of the substratebased on an output result of the thermo sensor; and a control partcontrolling an irradiation intensity of the lamp part according to thetemperature of the substrate computed by the temperature computing part,wherein the control part is provided to make an output power of the lamppart decrease intermittently and to control the irradiation intensity ofthe lamp part according to a temperature of the substrate computed bythe temperature computing part based on a radiation light which isreceived by the thermo sensor when the output power of the lamp part isdecreased.
 25. The rapid thermal processing apparatus according to claim18 wherein the lamp part comprises a plurality of heating lamps eachoptically irradiating and heating the substrate, and the thermo sensorcomprises a plurality of thermo sensors arranged corresponding to theplurality of heating lamps respectively.
 26. The rapid thermalprocessing apparatus according to claim 25 wherein the control partcontrols an irradiation intensity of each of the plurality of heatinglamps respectively.
 27. The rapid thermal processing method according toclaim 21 wherein the lamp part comprises a plurality of heating lampseach optically irradiating and heating the substrate, and the thermosensor comprises a plurality of thermo sensors arranged corresponding tothe plurality of heating lamps respectively.
 28. The rapid thermalprocessing method according to claim 27 wherein in the controlling stepis performed so that an irradiation intensity of each of the pluralityof heating lamps is controlled respectively.
 29. The rapid thermalprocessing apparatus according to claim 24 wherein the lamp partcomprises a plurality of heating lamps each optically irradiating andheating the substrate, and the thermo sensor comprises a plurality ofthermo sensors arranged corresponding to the plurality of heating lampsrespectively.
 30. The rapid thermal processing apparatus according toclaim 29 wherein the control part controls a irradiation intensity ofeach of the plurality of heating lamps respectively. 31-44. (canceled)